Mitsubishi Plastics, Inc.

Hideyasu Miyazaki

Takeyoshi Yamada

Jun Takagi

Kouichirou Taniguchi

Takashi Hiruma

Yukihiro Tanaka

The present invention relates to a heat-shrinkable laminate film comprising a surface layer composed mainly of polyester resin, an intermediate layer composed mainly of styrene resin, and an adhesive layer composed mainly of adhesive resin, wherein heat shrinkage in the main shrink direction is at least 10% and less than 30% when the film is dipped in water of 70&#xb0; C. for 10 seconds, and at least 30% and at most 70% when dipped in water of 80&#xb0; C. for 10 seconds, or its tensile modulus of elasticity in a direction perpendicular to the main shrink direction is at least 1,200 MPa. The heat-shrinkable film has excellent film elasticity, shrink finishing quality, transparency when incorporated as recycled, natural shrinkage, and suppressed delamination, making it suitable for application in shrink wrapping, shrink bundling wrapping, shrink label, and a plastic container provided with a heat shrinkable film made of such a film.

Heat-shrinkable laminate film, molded product and heat shrinkable label employing the film, and container

A heat-shrinkable polyolefin series laminated film having excellent firmness (stiffness at ordinary temperature) of film, resistance to fingerprint bleaching, shrink finishability, transparency and regeneration additivity, with a small natural shrinkage and accurately separable by specific gravity, can be provided by, in a laminated film provided with a surface layer (I) and an intermediate layer (III), forming the surface layer (I) with a mixed resin of cyclic olefin series resin and a polyethylene series resin (A) with a Tm of 80&#xb0; C. or higher but no greater than 125&#xb0; C. as a main component, and, forming the intermediate layer (III) with a resin composition having as a main component a cyclic olefin series resin, preferably a mixed resin composition of a cyclic olefin series resin and a polyethylene series resin (C) with a Tm exceeding 125&#xb0; C. but no greater than 140&#xb0; C., as a main component.

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Shiga, Japan

Hideyasu Miyazaki