Totokasei Co., Ltd.

Other

Tohto Kasei Co., Ltd.

Hideyasu Asakage

Yukio Nakamura

Yoshiaki Nakamura

Katsumi Moronuki

Motoko Hiraki

Nobuhisa Saito

Seigo Takuwa

Chiaki Asano

Xiao Li Wu

Michio Aritomi

A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150&#xb0; C. to produce a multi-functional epoxy compound represented by the general formula (II) 

Process for producing high-purity epoxy resin and epoxy resin composition

An ink jet recording sheet having an excellent jet ink-fixing property and heat-sealing property and capable of recording thereon ink images having excellent water resistance and light fastness has an ink receiving layer formed on a surface of a support sheet and including a binder and fine particles of a water-insoluble, amino group-containing resin having a total amine value of 5 to 500 and preferably a glass transition temperature of 15 to 250&deg; C.

Ink jet recording sheet

This invention relates to a semiconductor encapsulating novolac type epoxy resin with the reduced stress, which is obtained by an addition reaction 1 to 15% of a novolac type epoxy resin of the following formula with a monohydric or dihydric aliphatic alcohol: ##STR1## (wherein R.sub.1 is hydrogen, halogen, alkyl, or aryl; R.sub.2 is selected from the group consisting of hydrogen, alkyl, aryl, or aryl having a substituent which may be glycidylether; and n is an integer not less than 0.)

Novolac type epoxy resin and electronic parts encapsulating resin

An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).

Epoxy resin composition containing alkylated hydroquinone epoxide

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Tokyo, Japan

Hideyasu Asakage