Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Hideya Tanaka

Kenichi Miyamoto

Minoru Kubota

Kosuke Yoshihara

Norimitsu Morioka

Walter Swanson

Ryoji Higuchi

A substrate washing apparatus, comprising a spin chuck for holding and rotating a substrate W, a brushing section including a scrubbing member which is brought into contact with a washing surface of the substrate held on the spin chuck and revolved on its own axis together with rotation of the spin chuck, a washing liquid supply mechanism for supplying a washing liquid through the brushing section onto the washing surface of the substrate, a pressure control mechanism for controlling a pressing force of the scrubbing member against the washing surface of the substrate, and a moving means for moving the scrubbing member relative to the substrate in a radial direction of the substrate, wherein the scrubbing member includes an abutting portion which is brought into contact with the washing surface of the substrate, and a non-contact peripheral portion positioned about the abutting portion and formed not to contact the washing surface of the substrate when the abutting portion is in contact with the washing surface of the substrate.

Apparatus and method for washing substrate

An apparatus for washing a substrate comprises a spin chuck for holding and rotating a substrate, washing brush mechanism for supplying a washing liquid onto a surface of the substrate held on the spin chuck, and applying a physical force to contaminants present on a surface of the substrate so as to remove contaminants, a supporting arm for supporting the washing brush mechanism, an arm driving mechanism for driving the supporting arm to move the washing means along the surface from a central portion toward a peripheral portion of the substrate, and a control device for controlling the operation of at least one of the washing means, the spin chuck and the arm driving mechanism so as to control the physical force acting on the contaminants present on the surface of the substrate depending on the state of the contaminants.

A developing apparatus for developing a photoresist-coated substrate comprises a spin chuck having a supporting surface smaller in size than the substrate and adapted to be spin-driven with the photoresist-coated substrate surface held upward, a cup surrounding the spin chuck, a developing solution nozzle for applying a developing solution on the photoresist-coated substrate held on the spin chuck, a first washing solution nozzle for applying a washing solution to the photoresist-coated surface of the substrate held on the spin chuck, a second washing solution nozzle for applying the washing solution to a rear surface of the substrate on the spin chuck, a liquid seal ring mounted substantially coaxial with the spin chuck and having a diameter greater than the supporting surface of the spin chuck and smaller than the substrate, and a liquid film forming section provided on an upper end of the liquid seal ring and located near and opposite a peripheral edge portion of a rear surface of the substrate on the spin chuck to provide a clearance relative to the peripheral edge portion of the rear surface of the substrate, in which the liquid film forming section includes a first wall portion situated substantially orthogonal to the rear surface of the substrate and in an outwardly facing relation, and a second wall portion gently inclined relative to the rear surface of the substrate and situated in an inwardly facing relation.

Apparatus and method for developing resist coated on substrate

Apparatus for developing a resist-coated substrate

Growing community of inventors

Kumamoto, Japan

Hideya Tanaka