Sharp Kabushiki Kaisha Corporation

Hideya Takakura

Kazuo Kusuda

Hiroyuki Shoji

Nobuyuki Ohe

Kazuhito Nagura

Yasushi Hasegawa

Yoshiki Yasuda

Light emitted from a light source such as LED and reflected by a fingertip is guided by a cover member onto a light receiving surface of an imaging element. A second resin part is provided that is in contact with the cover member and a resin molded part sealing the imaging element. The reflected light guided by the cover member is made to reach the light receiving surface via the second resin part and the resin molded part, traveling along a path spaced apart from an air layer.

Optical pointing device and electronic equipments

An optical-electrical composite cable as an example of an optical-electrical composite transmission device has a flexible board as an electrical signal transmission member having an electric wiring section, and an optical fiber as an optical signal transmission member. The optical fiber is passed through a plurality of holes formed in a resin base section of the flexible board so as to thread through the resin base section. The flexible board and the optical fiber are integrated so as not to be separated from each other, so that even when the characteristics (tensile strength, thermal expansion coefficient) of the transmission lines respectively embodied by the flexible board and the optical fiber are different, the optical-electrical composite cable has stable flexibility as a whole.

Optical-electrical composite transmission device and electronic equipment

An optical semiconductor elementis mounted on a lead frame, the optical semiconductor elementis encapsulated with a mold resin portionof a first layer that has light permeability, and the mold resin portionof the first layer is encapsulated with a mold resin portionof a second layer that has light permeability. Then, a coefficient of linear expansion of the mold resin portionof the first layer is made smaller than a coefficient of linear expansion of the mold resin portionof the second layer.

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

An optical semiconductor device has an optical semiconductor element () such as an LED or PD, and a light-permeable resin () encapsulating the optical semiconductor element. The light-permeable resin contains a base resin and filler. The light-permeable resin () has a characteristic that its transmittance increases with a temperature rise within an operating temperature range (e.g., &#x2212;40&#xb0; C.&#x2212;+85&#xb0; C.).

Optical semiconductor device, optical communication device, and electronic equipment

A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.

Photo-coupler semiconductor device and production method therefor

A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in parallel with each other so as to orthogonally cross the tie bars, with a plurality of lead terminals being placed in a staggered form in a manner so as to orthogonally cross the tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames, in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

Method of manufacturing a lead frame

A lead frame of an optical coupling device of the present invention is so arranged that (a) a light-emitting side section in which a plurality of header sections for mounting thereon the light-emitting elements are aligned and (b) a light-receiving side section in which a plurality of header sections for mounting thereon the light-receiving element are aligned, and (c) a connecting section for connecting the light-emitting side section and the light-receiving side section in parallel into one body. The light-emitting side section and the light-receiving side section are integrated via a connecting section at which a V groove is formed for facilitating the folding of the lead frame. As a result, it is possible to provide a low-cost lead frame of an optical coupling device with a small number of components can be realized, in a simplified manner, and a manufacturing method of the optical coupling device.

Method of making an optical coupling device

In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads and to come into contact with a punch during the tie bar cutting step). The first notches prevent troubles associated with close arrangement of the second tie bars and the plastic packages. In addition, second notches are provided along second edges of the second tie bars. These second notches are designed to receive the tips of outer leads which extend from neighboring plastic packages of the lead frames.

Lead frame for a plastic encapsulated semiconductor device

A photocoupler device includes a light emitting element; a monitor photodetector and an output photodetector for receiving light from the light emitting element; a primary side lead frame for mounting the light emitting element and the monitor photodetector; and a secondary side lead frame for mounting the output photodetector, wherein the light emitting element and the output photodetector are placed so as to face each other.

Growing community of inventors

Nara, Japan

Hideya Takakura