Tdk Corporation

Hideya Matsubara

Atsunori Okada

Yuichiro Okuyama

Masashi Iwata

Tatsuya Fukunaga

Shigemitsu Tomaki

Shinichiro Toda

Masami Itakura

Takeshi Oohashi

Shinya Nakai

Tomoyuki Goi

Hideaki Fujioka

Naoto Ohyama

Steve Plager

Shoichi Ohi

Shinichiroh Toda

A band-pass filter includes a first inductor and a second inductor electromagnetically coupled to each other, a first ground terminal electrically connected to the first inductor, a second ground terminal electrically connected to the second inductor, and a stack for integrating the first inductor, the second inductor, the first ground terminal, and the second ground terminal. The first ground terminal and the second ground terminal are each connected to a ground and are not electrically connected to each other in the stack.

Multilayer band-pass filter

A balanced-output triplexer includes: a first filter provided between an input terminal and a pair of first balanced output terminals; a second filter provided between the input terminal and a pair of second balanced output terminals; and a third filter provided between the input terminal and a pair of third balanced output terminals. All of the first to third filters are provided within a layered substrate. All of the balanced output terminals are disposed to be adjacent to one of the sides of the top surface of the layered substrate and one of the sides of the bottom surface of the layered substrate.

Balanced-output triplexer

A balanced-output triplexer includes: a first filter provided between an input terminal and a pair of first balanced output terminals; a second filter provided between the input terminal and a pair of second balanced output terminals; and a third filter provided between the input terminal and a pair of third balanced output terminals. Each of the first to third filters has a pair of output resonators that are interdigital-coupled to each other and connected to the corresponding pair of balanced output terminals.

A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.

Band-pass filter element and high frequency module

A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexer connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.

High frequency module

A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.

A high frequency filter incorporates: an unbalanced input/output terminal; two balanced input/output terminals; two resonators respectively provided between the unbalanced input/output terminal and the two balanced input/output terminals; and a layered substrate for integrating components of the high frequency filter. The two resonators are inductively coupled to each other, and are also capacitively coupled to each other through two capacitors. Each of the two capacitors is formed using a pair of first and second electrodes and a dielectric layer. The first electrode is connected to one of the resonators via a through hole. The second electrode is connected to the other of the resonators and opposed to the first electrode forming the pair with the second electrode, the dielectric layer being disposed between the second electrode and the first electrode.

High frequency filter

A high frequency module comprises: a switch circuit connected to two antenna terminals; a diplexer connected to two reception signal terminals and the switch circuit; and a diplexter connected to two transmission signal terminals and the switch circuit. Each of the diplexers incorporates two band-pass filters and a low-pass filter. Each of the band-pass filters is formed by using a resonant circuit.

A high frequency filter comprises a first resonator and a second resonator provided inside a layered substrate. The first and second resonators are inductively coupled and capacitively coupled to each other through a first capacitor and a second capacitor connected to each other in parallel. The first capacitor is formed using first and third electrodes and a dielectric layer. The first electrode is connected to the first resonator via a through hole. The third electrode is connected to the second resonator and opposed to the first electrode. The second capacitor is formed using second and fourth electrodes and the dielectric layer. The second electrode is connected to the second resonator via a through hole. The fourth electrode is connected to the first resonator and opposed to the second electrode.

A high frequency filter incorporates first to third resonators provided inside a layered substrate. The first and third resonators are adjacent to each other and inductively coupled to each other. The second and third resonators are also adjacent to each other and inductively coupled to each other. The first and second resonators are not adjacent to each other but are capacitively coupled to each other through a conductor layer for capacitive coupling. The conductor layer for capacitive coupling incorporates: a first portion for forming a first capacitor between itself and the first resonator; a second portion for forming a second capacitor between itself and the second resonator; and a third portion having an end connected to the first portion and the other end connected to the second portion, the ends being opposed to each other in the longitudinal direction. The width of at least part of the third portion is smaller than the width of each of the first portion and the second portion.

A high frequency module comprises a switch circuit connected to two antenna terminals and two diplexers connected to the switch circuit. Each of the diplexers incorporates two band-pass filters (BPFs). Each of the diplexers further incorporates a capacitor provided between one of the BPFs and a node of signal paths and another capacitor provided between the other of the BPFs and the node.

A multi-layer band-pass filter comprises an unbalanced input, two balanced outputs, and a band-pass filter section provided between the unbalanced input and the two balanced outputs. The band-pass filter section incorporates a plurality of resonators each of which is made up of a TEM line. The band-pass filter further comprises a multi-layer substrate used for integrating the resonators. The band-pass filter section incorporates, as the resonators, an input resonator, and a half-wave resonator for balanced output that is made up of a half-wave resonator having open-circuited ends. The unbalanced input is connected to the input resonator through a capacitor. Each of the balanced outputs is connected to the half-wave resonator through a capacitor.

Multi-layer band-pass filter

A balun comprises an unbalanced terminal, two balanced terminals, and two ground terminals. The balun further comprises: a low-pass filter provided between the unbalanced terminal and one of the balanced terminals; and a high-pass filter provided between the unbalanced terminal and the other of the balanced terminals. The low-pass filter incorporates two coils and a capacitor. The high-pass filter incorporates two capacitors and a coil. The coils and the capacitors are made up of conductor layers of a multi-layer substrate.

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Tokyo, Japan

Hideya Matsubara