Ricoh Company, Ltd.

Hidetsugu Miyake

Koichi Sogawa

Tadao Uehara

Tohru Haruki

Kenji Nishihara

Masanori Miyata

Fumihiro Fuchino

Shouji Tochishita

Kiyoshi Yano

Minoru Ohtomo

Mikinori Oguni

Akira Washino

A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.

Wafer, reticle, and exposure method using the wafer and reticle

A disclosed semiconductor wafer includes plural semiconductor chip areas each having a color pattern capable of tracing the positional information of the semiconductor chip with respect to the semiconductor wafer. Each of the plural semiconductor chip areas arranged in a matrix manner on the semiconductor wafer includes an underlying insulation film; a wiring pattern and a frame-shaped wiring dummy pattern formed on the underlying insulation film; and plural insulation films formed on the upper side of the underlying insulation film, the wiring pattern, and the wiring dummy pattern. At least one SOG film is included in the plural insulation films, in which a color pattern in accordance with a distance from the center of the semiconductor wafer based on the SOG film is formed on a surface of the insulator film within the wiring dummy pattern in top view.

Semiconductor wafer, semiconductor chip cut from the semiconductor wafer, and method of manufacturing semiconductor wafer

Growing community of inventors

Hyogo, Japan

Hidetsugu Miyake