Sony Corporation

Hidetoshi Yamanaka

Daisuke Yoshioka

Shigeru Atsumi

Toshiyuki Nishihara

Ikuhiro Yamamura

Naoshi Ikeda

Toshiyuki Nishimura

A semiconductor memory device able to read out data at a high speed continuously, provided with, corresponding to a plurality of banks, current address registers for holding addresses for reading data of cell arrays, reserved address registers able to receive in advance and hold reserved addresses for next read operations from the outside, and bank control circuits for making the current address registers hold reserved addresses held in the reserved address registers, making the data be read out, and making the data latch circuits hold the data when the data read out from the cell arrays of the banks by addresses held in the current address registers and held in the data latch circuits become able to be transferred to the outside, and a signal processing system relating to the same.

Semiconductor memory device and signal processing system

A semiconductor memory device using inexpensive block access semiconductor memories for storage media and able to be treated like a usual randomly accessible system memory, including a first semiconductor memory and a second semiconductor memory, wherein the second semiconductor memory is a cache of the first semiconductor memory, the first semiconductor memory is accessed via the second semiconductor memory, there are a first address region and a second address region on logical memory addresses accessed from the outside, at least part of the second semiconductor memory is mapped to the first address region, and a function of controlling data transfer between the first semiconductor memory and the second semiconductor memory by accessing the second address region is provided, and an access method and a memory control system of the same.

Semiconductor memory device and access method and memory control system for same

A semiconductor nonvolatile memory device using SA-STI cells improved in quality and suitable for increasing the degree of integration is provided with a semiconductor substrate having in its surface a channel formation region; an element isolation insulating film buried in a trench formed in the semiconductor substrate so as to divide the channel formation region into a plurality of regions; a gate insulating film formed on the channel formation region; a floating gate provided with a first floating gate formed at an upper layer of the gate insulating film and second floating gates formed at facing sides of the same; an inter-layer insulating film formed at an upper layer of the first floating gate and the second floating gates; a control gate formed at an upper layer of the inter-layer insulating film; and a source-drain region former connected to the channel formation region.

Growing community of inventors

Saitama, Japan

Hidetoshi Yamanaka