Panasonic Intellectual Property Management Co., Ltd.

Panasonic Electric Works Co., Ltd.

Hidetoshi Takeyama

Daisuke Sato

Mitsuru Iida

Hiroshi Iwano

Hisanobu Tanaka

Kenji c/o Matsushita Electric Works Ltd Ookura

Hirohisa c/o Matsushita Electric Works Ltd Tanaka

Masato Matsushita Electric Works Ltd Shinotani

Hisanobu c/o Matsushita Electric Works Ltd Tanaka

A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Connector assembly and female connector used for the same

A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.

Connector assembly

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Mie, Japan

Hidetoshi Takeyama