Canon Anelva Corporation

Google Inc.

Hidetoshi Shimokawa

Shinji Takagi

Naoya Fukuda

Jun Miura

Kavi J Goel

Satoru Stephen Yamauchi

Yang-Hua Chu

Taichi Hiromi

Slaven Bilac

Atsuyuki Ichikawa

Mingmin Xie

Satoshi Negishi

Junya Soeda

Toshihiro Yoshino

Satoshi Nomura

Shuji Kumagai

Tetsuro Toda

A load lock device includes a load lock chamber including a first conveyance port connected to a transfer chamber connected to a reduced-pressure processing device, and a second conveyance port connected to a loader chamber; a substrate holder configured to hold a substrate in the load lock chamber; a driving mechanism arranged below the load lock chamber to move the substrate holder up and down and connected to the substrate holder via a connecting member; an extension chamber extended from a lower portion of the load lock chamber to a side; and a pump arranged below the extension chamber and configured to discharge a gas in the load lock chamber via the extension chamber. The extension chamber includes a bottom surface with an opening at a position deviated from a vertically lower position of the substrate holder, and the pump is connected to the opening.

Load lock device

A load lock device includes a load lock chamber, and a substrate holding structure configured to hold a substrate in the load lock chamber, wherein the substrate holding structure includes a facing surface facing the substrate, and is configured to allow a gas to flow through a space between the substrate and the facing surface, and in a state in which the substrate is held by the substrate holding structure, a distance between the substrate and a portion located inside an outer edge of the facing surface is larger than a distance between the substrate and the outer edge of the facing surface.

A sputtering apparatus includes a space defining member defining a sputtering space for forming a film on a substrate. The space defining member includes a concave portion, and an opening portion is provided in the bottom portion of the concave portion. The sputtering apparatus includes a shield member configured to shield the opening portion from the sputtering space. The opening portion is formed so that a pressure gauge capable of measuring the pressure in the sputtering space can be attached, and the shield member is arranged so that at least a part of the shield member is buried in the concave portion.

Sputtering apparatus and processing apparatus

Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for ranking events. One of the methods includes receiving data identifying a physical location; obtaining data identifying a plurality of events occurring in the physical location during a particular time period; computing a respective plurality of signal scores for each of the events, wherein computing the respective plurality of signal scores for each of the events comprises computing a first signal score for each of the events based at least in part on a count of Internet sites that include at least one mention of the event; computing a respective popularity score for each of the plurality of events by combining the respective plurality of signal scores for the event; and generating a ranking of events occurring in the physical location during the particular time period based at least in part on the popularity scores.

Ranking events

Growing community of inventors

Tokyo, Japan

Hidetoshi Shimokawa