Senju Metal Industry Co., Ltd.

Sony Corporation

Hidetoshi Nakamura

Ryoichi Suzuki

Mitsuo Zen

Hisashi Suwa

Kenichi Tomitsuka

Kinjiro Takayama

Tatsuo Fujita

A jet solder bath is comprised of a bath unit which contains a molten solder, a nozzle member provided within the bath unit and constructing a nozzle mouth, a tank provided in at least one side of the nozzle member along the nozzle mouth and temporarily accumulating a solder jetted from the nozzle mouth, and a molten solder outlet provided on the lower portion of the tank and communicating the tank with a molten solder still area provided within the solder bath unit under the liquid level of the molten solder. According to the above-mentioned arrangement, the molten solder can be suppressed from being oxidized as much as possible and the removal of a resultant oxide can be facilitated.

Jet solder bath

A reflow apparatus for soldering has a tunnel and a pipe which form an endless passageway for hot gas. Infrared panel heaters are disposed inside the tunnel for heating printed circuit boards which travel through the tunnel on a conveyor. Hot gas is made to circulate through the passageway by a flow-producing device. A filter is disposed in the passageway for removing particles from fumes which are formed during soldering.

Solder reflow apparatus

Growing community of inventors

Tokyo, Japan

Hidetoshi Nakamura