Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Hidetoshi Miyahara

Jia Liu

Kenichi Agawa

Atsushi Kurosu

Yusuke Imaizumi

Atsushi Tomishima

According to one embodiment, a semiconductor device c includes: a package substrate including a base including a mount portion, and terminals; a semiconductor chip including a first pad to which a ground voltage is supplied, a second pad electrically connected to a first terminal among the terminals, and a semiconductor circuit connected to the first and second pads, the semiconductor chip being provided above the mount portion; and a first capacitor chip including a first capacitor unit provided in a silicon substrate, a first node supplied with the ground voltage, and a second node electrically connected to the second pad, the first capacitor chip being provided above the mount portion.

Growing community of inventors

Kawasaki, Japan

Hidetoshi Miyahara