Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Hidetoshi Furukawa

Daisuke Ueda

Tsuyoshi Tanaka

Hidetoshi Ishida

Yukio Iwasaki

Takeshi Fukui

Takeshi Fukuda

Toshiya Fukuhisa

Masaya Mannoh

Atsushi Noma

Kazuo Miyatsuji

Hiroshi Takenaka

The RF device of the present invention includes: a semiconductor substrate; and first and second semiconductor components provided on the substrate. Each of the components includes source electrodes, a gate electrode and a drain electrode. And multiple through holes, which pass through the substrate in the thickness direction, are opened in a region of the substrate between the two components. To enhance the effect of suppressing electrical interference between the components, a gap between two adjacent ones of the through holes is preferably smaller than the thickness of the substrate.

Radio frequency signal processing device

A semiconductor laser device includes: a first light emitting device, the first light emitting device including a first first-conductive-type cladding layer, a first active layer having a first window region in the vicinity of a light emitting edge surface and a first second-conductive-type cladding layer stacked in this order on a substrate; and a second light emitting device, the second light emitting device including a second first-conductive-type cladding layer, a second active layer having a second window region in the vicinity of a light emitting edge surface and a second second-conductive-type cladding layer stacked in this order on the substrate. In the semiconductor laser device, respective lattice constants of the first second-conductive-type and second second-conductive-type cladding layers are adjusted to compensate for a difference in diffusion rate of an impurity between the first window region in the first active layer and the second window region in the second active layer.

Semiconductor laser device and method for fabricating the same

A regulating resistor network includes a plurality of resistors connected in parallel to each other. Each of these resistors is cuttable by being irradiated with light, and a resistance value of the regulating resistor network is adjustable by cutting at least one of the resistors off.

Regulating resistor network, semiconductor device including the resistor network, and method for fabricating the device

A via hole having a bottom is formed in a substrate and then a conductor layer is formed at least over a sidewall of the via hole. Thereafter, the substrate is thinned by removing a portion of the substrate opposite to another portion of the substrate in which the via hole is formed such that the conductor layer is exposed.

Method of making a semiconductor device including testing before thinning the semiconductor substrate

A resistive area,is formed selectively on a semi-insulating substrate,and ohmic electrodes,are formed on both ends of the resistive area. Then a photo resist,having an opening,between the electrodes,is so formed as not completely across the resistive area,A desirable resistance value is thus obtained by removing the resistance area,by etching through the opening,gradually.

Method of manufacturing a resistor in a semiconductor device

A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor. The semiconductor integrated circuit is provided so as to have a predetermined resistance by measuring electric characteristics of the semiconductor integrated circuit; obtaining a difference between the measured electric characteristics and desired electric characteristics to calculate a required adjusting amount of a resistance of the thermal resistor; and adjusting the resistance of the thermal resistor by the adjusting amount through heating of the thermal resistor with electric power.

Semiconductor integrated circuit with tungston silicide nitride thermal

Variations in the waveform of high-frequency signals amplified by a field-effect transistor (FET) in a power amplification circuit due to changes in temperature are reduced. A FET having an n-type active layer, a source electrode, a drain electrode and a gate electrode is formed on a (1 0 0)-crystal plane of a semi-insulating GaAs substrate. The FET is protected by a passivation film. The angle .theta., formed between the longitudinal axial direction of the gate electrode and the &lt;0 -1 -1&gt;-direction, is set at an angle of from 0.degree. to 90.degree. corresponding to the impurity concentration of the n-type active layer, in order that the temperature coefficient of the FET threshold voltage becomes substantially equal to the temperature coefficient of the gate bias voltage applied from a power supply to the gate electrode. If the angle .theta. is set at 45.degree., then the temperature coefficient of the FET threshold voltage becomes zero.

Growing community of inventors

Osaka, Japan

Hidetoshi Furukawa