Kyocera Corporation

Hideto Yonekura

Noriaki Hamada

Masahiko Higashi

Kenichi Nagae

Kouichi Yamaguchi

Satoru Hamano

Youji Furukubo

Yoshitake Terashi

Yoshihiro Nakao

Yasuhide Tami

Masamitsu Onitani

Takeshi Kubota

Yasuyoshi Kunimatsu

Takahiro Matsuoka

Yohji Furukubo

A glass ceramic sintered product obtained by sintering a mixture powder containing a BaO-containing glass, metal oxide particles having a coefficient of linear thermal expansion at 40 to 400&deg; C. of not smaller than 6 ppm/&deg;C., and a Zr compound and, particularly, containing the Zr compound in an amount of from 0.1 to 30% by weight calculated as Zr0 , and exhibiting a coefficient of linear thermal expansion at 40 to 400&deg; C. of from 8.5 to 18 ppm/&deg;C. The glass ceramic sintered product exhibits excellent resistance against chemicals and does not discolor even when subjected to treatment with an acidic or alkaline solution in the step of plating. A wiring board using the glass ceramic sintered product as an insulating substrate exhibits a coefficient of linear thermal expansion substantially similar to that of an external circuit board, effectively suppressing the occurrence of thermal stress and cracking.

High-thermal-expansion glass ceramic sintered product

A low-temperature calcined ceramic of the present invention comprises a sintered body obtained by calcining a mixture of a glass and an SiO.sub.2 filler such as quartz or cristobalite, wherein the sintered body contains an SiO.sub.2 crystal having an X-ray diffraction image that the peak at the (101) plane of quartz or cristobalite is shifted at least 0.05.degree. (2.theta.) to the lower angle side. The ceramic containing the shifted crystal of quarts or cristobalite does not have a region of abruptly changing the thermal expansion and has a substantially linear thermal expansion curve. Accordingly, when the ceramic is used as an insulating substrate of a wiring boad, there is no possibility of abruptly causing the thermal expansion by heating, etc., at mounting on an external electric circuit boad and the occurrence of the inferior connection, etc., by thermal expansion can be effectively prevented.

Low-temperature calcined ceramics

In a circuit board obtained by providing a metallized layer of wiring on the surface or interior of an insulation substrate, the insulation substrate is, for example, a multi-layer circuit board or a package for semiconductor element, the insutating substrate obtained from a sintered body having a linear expansion coefficient of 8 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. which is prepared by sintering a molded body containing 20 to 80% of a glass having a liner expansion coefficient of 6 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. and 80 to 20% of a filler having a linear expansion coefficient of at least 6 ppm/.degree. C. When the circuit board of the present invention is surface mounted on an outer electric circuit substrate such as a printed wiring board having a large linear expansion coefficient, the occurrence of stress due to a difference between the linear expansion coefficients of both is suppressed, and the circuit board and the outer electric circuit can be electrically connected accurately and firmly over a long period of time. Furthermore, a mounted structure of a circuit board having high reliability which can sufficiently dealt with the use of multiple pins due to large sizing of a semiconductor element can be realized. Furthermore, simultaneous sintering with the Cu metallized layer can be performed, and since the binder can be removed efficiently, the product is of high quality and is cheap.

Circuit board

A glass-ceramic sintered body containing Si, Al, Zn, element of Group 2a and Group 4a of the periodic table, and Boron and Oxygen, as constituent elements, and comprising a glass phase and crystalline phases, wherein the crystalline phase comprises a first crystalline phase of a composite oxide containing at least Si, Al and Ca or Sr, or, Si, Al, Ca and Sr, a second crystalline phase of ZrO.sub.2 crystalline and a third crystalline phase of spinel crystalline is presented. The glass-ceramic sintered body has a high dielectric constant of not smaller than 8.5 and have a fracture strength of not smaller than 20 kg/mm.sup.2 and preferred as an insulation substrate of a circuit board, a substrate board for mounting an integrated circuit or an electronic compornent part.

Glass-ceramic sintered body

A glass-ceramic sintered body comprising an SiO.sub.2 --Al.sub.2 O.sub.3 --MgO--ZnO--B.sub.2 O.sub.3 type crystalline glass and alumina, said sintered body containing at least 10% by weight of a spinel crystalline phase; and a substrate composed of the sintered material. There is also provided a process for producing the glass-ceramic sintered body which comprises adding a binder to a mixed powder of an SiO.sub.2 --Al.sub.2 O.sub.3 --MgO--ZnO--B.sub.2 O.sub.3 type crystalline glass and alumina, molding the mixture into a predetermined shape, and firing the mixture into a predetermined shape, and firing the molded mixture at a temperature of 925.degree. to 1000.degree. C. in a non-oxidizable atmosphere. The glass-ceramic sintered body and the substrate composed of it in accordance with the present invention have excellent mechanical strength and thereby have markedly increased metallizing adhesion strength.

Glass-ceramic sintered body, a process for its preparation and a

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Kokubu, Japan

Hideto Yonekura