Tdk Corporation

Hideto Itoh

Yoshihiro Maeda

Tomokazu Ito

Hitoshi Ohkubo

Manabu Ohta

Takahiro Kawahara

Yuuya Kaname

Takashi Nakagawa

Makoto Morita

Kyohei Tonoyama

A coil componentis provided with coil conductorsandand a magnetic metal powder containing resin(and) covering the coil conductorsand. The magnetic metal powder containing resinincludes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 &#x3bc;m or more and 100 &#x3bc;m or less. The third average grain diameter is 2 &#x3bc;m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.

Coil component and magnetic metal powder containing resin used therefor

A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.

Coil component

A coil componentincludes a substrate, a planar spiral conductorformed on a top surfaceof the substrate, a lead conductorconnected to an outer peripheral end of the planar spiral conductor, a dummy lead conductorformed on the top surface of the substrateand between an outermost turn of the planar spiral conductorand an endXof the substrateand free from an electrical connection with another conductor within the same plane, external electrodesandarranged in parallel with the top surface of the substrate, and a bump electrodeformed on a surface of the lead conductorand connects the lead conductorwith the external electrode. The external terminalsandhave a larger area than the bump electrodesandfor securing a bonding strength.

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Tokyo, Japan

Hideto Itoh