Ebara Corporation

Hidetatsu Isokawa

Koji Maeda

Kuniaki Yamaguchi

Mitsuhiko Inaba

Hiroshi Shimomoto

Kenji Shinkai

Hiroshi Aono

Soichi Isobe

Haiyang Xu

Koichi Hashimoto

Tetsuya Yashima

Shun Ehara

Mitsuru Miyazaki

Junji Kunisawa

Fujihiko Toyomasu

Masayuki Tamura

Hidetaka Nakao

Xu Haiyang

Dai Yoshinari

Kentaro Asano

Provided is a method, device, and program for determining a timing of removing a substrate from a cassette in substrate processing device, and substrate processing device. In the method, a tentative removal time point of each substrate is calculated by adding a transfer time to a tentative removal time point of the one previous substrate, wherein the transfer time is required from the start of an action of removing a substrate from the cassette to the end of an action of delivering the substrate to an exchanger.

Method, device, and non-transitory computer readable medium for determining timing of removing substrate from cassette in substrate processing device, and substrate processing device

A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.

Substrate processing apparatus

A cleaning device is described. In one embodiment, the cleaning device includes a cleaning member; a moving portion, a measurement portion, and a controller. The controller performs a reset operation in which the cleaning member is pressed against the reference member before cleaning, a cleaning member is moved in a direction away from the reference member after the measured value of the measurement portion reaches a predetermined reset load, when the measurement values of the measurement portion for each unit movement amount of the cleaning member become equal to each other at least twice consecutively, a position of the cleaning member at the time is set as a reference position of the cleaning member at the time of cleaning, and the measurement value of the measurement portion at the time is set as a pressing reference value at the time of cleaning.

Cleaning device, substrate processing apparatus, maintenance method of cleaning device, and computer-readable recording medium including maintenance program of cleaning device

A mechanism that conveys a substrate is cleaned in a cleaning unit. A substrate processing apparatus that includes a substrate polishing device and a substrate cleaning unit is disclosed. The substrate cleaning unit includes a cleaning module and a cleaning unit conveyance mechanism. The cleaning unit conveyance mechanism includes a hand and a hand open/close mechanism. The substrate processing apparatus further includes a hand cleaning unit. The hand cleaning unit includes a hand cleaning tank and a cleaning liquid injection mechanism.

A substrate processing apparatus is disclosed. In an embodiment, a substrate processing apparatus includes a plurality of polishing units including discharge valves that can discharge water at a predetermined flow rate, a plurality of cleaning units including discharge valves that discharges water at a predetermined flow rate, and a controller that controls opening and closing of the discharge valve of each of the plurality of polishing units and the plurality of cleaning units, and the controller controls opening and closing of the discharge valves of the plurality of polishing units and the plurality of cleaning units based on predetermined priority orders allocated to the plurality of polishing units and the plurality of cleaning units, so that the total discharge flow rate from the plurality of polishing units and the plurality of cleaning units is a predetermined flow rate or less.

Substrate processing apparatus and method of controlling the same

A teaching apparatus is provided with an arm-side position sensor attached to arms, a dummy wafer placed on a stage, a dummy-wafer-side position sensor attached to the dummy wafer, and a signal receiver configured to receive a position signal from the arm-side position sensor to determine a position coordinate of the arm-side position sensor, and receive a position signal from the dummy-wafer-side position sensor to determine a position coordinate of the dummy-wafer-side position sensor. A control part, based on the position coordinate of the dummy-wafer-side position sensor, calculates a position coordinate of the arm-side position sensor when the arms hold the wafer, and moves the arms such that the arm-side position sensor moves to the calculated position coordinate.

Teaching device and teaching method

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Growing community of inventors

Tokyo, Japan

Hidetatsu Isokawa