Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Hidetaka Satou

Mitsumasa Kojima

Daisuke Makino

Tohru Kikuchi

Mitsuo Yamazaki

Nobuo Ichimura

Masao Kawasumi

Yasuo Miyamoto

Kohei Fujita

Yasuo Miyadera

Takayuki Saito

Masami Yusa

Makoto Kaji

Fusaji Shoji

Hiroshi Suzuki

Shigeki Katogi

Hideo Hagiwara

Fumio Kataoka

Hideo Sotokawa

Masataka Nunomura

Katsuji Shibata

Yasunori Kojima

Shun-ichiro Uchimura

Masatoshi Yoshida

Toshihiko Kato

Hiroyoshi Sekine

Dai Kawasaki

Toul Kikuchi

An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.

Photoinitiator compositions including amino acids, coumarin and

An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Epoxy resin and adhesive composition containing the same

The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.

Polyimide precursor, cured product thereof, and processes for producing

An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.

Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

Processes for preparation of polyimide-isoindroquinazolinedione and

There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:

Process for producing polyamide acid having siloxane bonds and polyimide

A liquid crystal display device containing a liquid crystal orientation controlling film made from a fluorine-containing polyimide-isoindoloquinazolinedione is high in a tilt angle and excellent in viewing properties.

Liquid crystal orientation controlling film and liquid crystal device

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Hitachi, Japan

Hidetaka Satou