Tohoku Pioneer Corporation

Pioneer Corporation

Hidetaka Ohazama

Hiroki Tan

Shinsuke Tanaka

Jun Sugahara

Atsusi Matsuda

Hiromu Nara

A light-emitting unit () is formed on one surface () of a substrate (). Further, the light-emitting unit () includes a first electrode (), an organic layer (), and a second electrode (). A covering member () covers the light-emitting unit (). An integrated circuit () is arranged on the one surface () of the substrate (). In addition, the integrated circuit () is electrically connected to at least one of the first electrode () and the second electrode (). A protective member () is located in a region () between the covering member () and the integrated circuit (). Further, the protective member () is provided so as to expose the entirety of a first surface () of the integrated circuit () on a side opposite to the substrate ().

Light emitting device, electronic device, and method for manufacturing light emitting device

When a coating filmis formed on a substrateon which elementsare formed, by an ALD film forming method or the like, the coating filmis partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substratepartially with a partially coating membera step of forming the elementson the substratea step of forming the coating filmon the substrateto cover the elementsand the partially coating memberand a step of forming a crackA in the coating filmon the partially coating member

Method for manufacturing electronic device

An electrical component () and a substrate () constitute at least a portion of an electrical device. At least one surface of the substrate () is formed of an insulator. A conductor () is formed on the one surface. The conductor () is covered with a sealing film (). The sealing film () is a film having insulation properties. An opening () is formed in the sealing film (). The opening () is located on a portion of the conductor () when seen in a plan view. The conductor () is connected to the electrical component () with an anisotropic conductive film () interposed therebetween. The anisotropic conductive film () overlaps the opening (), and contains a plurality of metal particles.

Connection structure for electrical component

An organic EL module includes an element substrate on which at least one organic EL element is formed, a first terminal provided on the element substrate and is drawn out from the electrode of the at least one organic EL element, a second terminal facing the first terminal and provided on a circuit substrate, and a pole that electrically connects the first terminal with the second terminal through a through-hole of the circuit substrate.

Organic EL module including an element substrate and a pole to connect a plurality of terminals

Accumulating spaces for conductive particles are formed in gaps of wiring patterns for conductive wirings which are disposed on a surface of a supporting body. When interconnecting a pair of interconnection objects having the respective wiring patterns via an anisotropic conductive film thereon due to a thermocompression bonding, the conductive particles to be flown-out into the gaps by the thermocompression bonding are allowed to escape into the accumulating spaces, so that an over-density of the conductive particles can be prevented to avoid a shortage in the wiring patterns.

Interconnection structure of electric conductive wirings

In the neighborhood of each connecting region of a panel substrate, tape automated bonding (TAB) substrates, and a flexible substrate, marks for a visual inspection are provided at a preset distance apart from the connecting region. According to the present marks, inferior products are eliminated with a high rate of accuracy upon visual inspection after completing a connection of display panel.

Mark for visual inspection upon assembling a display

A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.

Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip

A test mark is provided, for use in an inspection after a display panel, TAB tapes, and a flexible board have been connected together. Defective panels can be rejected with high accuracy in the simple inspection, thereby mitigating the burden on the microscopic inspection. At a predetermined distance from each of connection areas for connecting a panel substrate, TAB tapes, and a flexible board, there are provided test marks with at least one on each component. The electrical connection is tested between each pair of the test marks to thereby determine whether the interconnection is in a good state.

Growing community of inventors

Yonezawa, Japan

Hidetaka Ohazama