Disco Corporation

Hidetaka Ochi

Takashi Mori

Shinichi Namioka

Masaaki Suzuki

Noriko Ito

Hirotoshi Hoshikawa

Masaaki Nagashima

Naoto Takata

Osamu Miura

A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.

Grinding apparatus

Growing community of inventors

Tokyo, Japan

Hidetaka Ochi