Yamaichi Electric Mfg. Co., Ltd.

Hidetaka Nakano

Yoshinori Egawa

Motoki Kosugi

A socket for an electronic device having leads projecting laterally therefrom comprises a socket substrate having grooves formed on one surface thereof for accommodating the leads therein and also having contacts which are plate members punched out of a strap of plate and bent in a substantially L-shape with a fold in the widthwise direction and each composed of a first plate strip and a second plate strip with the fold as a boundary, the first plate strip having one surface laid along and supported on the bottom of the groove to thereby serve as a rigid contact, the second plate strip being implanted from the bottom of the groove in the socket substrate to project downwardly from the lower surface of the socket substrate and serve as a male terminal, and a cover being superposed on and fixed with fastening means to the socket substrate and having resilient pressure strips each resiliently clamping, in cooperation with the other surface of the first plate strip, the lead of the electronic device accommodated in the groove of the socket substrate.

Socket for electronic device

In a flat cable connecting system comprising pinching a multiple core flat cable between a connector cover and a connector substrate having contacts to cause the contacts to pierce through an insulator of the multiple core flat cable and, in conjunction therewith, to catch hold of and electrically connect conductors within the insulator of the multiple core flat cable, the improvement comprises forming in the insulator perforations for dividing the conductors into conductor segments extending in one direction and conductor segments extending in the other direction, and causing different signal contacts of the connector substrate to catch hold of and electrically connect the respective conductor segments at their terminals on the perforation sides, thereby forming different signal lines with the perforations as boundaries.

Flat cable connecting system

An IC socket with IC package pressing means comprises a socket substrate, an IC package pressing plate having one end thereof pivotally link-connected to one end of the socket substrate, and an operative lever having one end thereof pivotally link-connected to the other end of the IC package pressing plate and provided with engaging claw pieces which collide against the other end of the socket substrate, lead the IC package pressing plate and the operative lever to their respective laid-down positions relative to the socket substrate and engage with the aforementioned other end of the socket substrate.

Growing community of inventors

Tokyo, Japan

Hidetaka Nakano