Micro Process Inc.

Mitsubishi Rayon Company, Limited

Everlight Chemical Industrial Corporation

Hidetaka Nakagawara

Akifumi Ueda

Shigeki Watanabe

Kazuo Watanabe

Wei Jen Lan

Chao Wen Lin

Saki Fujita

Shintaro Okada

The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (&#x3b1;) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (&#x3b2;) containing a vinyl-based monomer (b) represented by CH&#x2550;CRCOO(RO)R(wherein R=a hydrogen atom or a methyl group, R=a hydrocarbon group having a carbon number of 1 to 4, R=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.

Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same

The present invention is related to a photosensitive resin composition containing: a vinyl-based copolymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group and a carboxyl group-containing vinyl monomer (b); a quinonediazide compound (II) and a compound (III) represented by the following formula (5), and to a photosensitive dry film and a method for forming a patter by using the photosensitive resin composition. According to the present invention, it is possible to provide a photosensitive resin composition which can form a resist film in which the occurrence of crack is suppressed, the film reduction of the unexposed area is suppressed, and sensitivity and resolution are excellent, and to provide a photosensitive dry film and a method for forming a pattern by using the photosensitive resist composition  [In the formula, Y is a straight or branched hydrocarbon group of 1 to 6 carbon atoms; 1 and m are respectively independently an integer of 1 to 3; n is 1 or 2; p and q are respectively independently 0 or 1.]

Photosensitive resin composition, photosensitive dry film and method for forming pattern

A photosensitive resin composition comprising: a vinyl-based polymer (I) obtained by polymerizing a monomer mixture containing a monomer (a) having a phenolic hydroxyl group; a vinyl-based polymer (II) obtained by polymerizing a monomer mixture containing a carboxyl group-containing vinyl monomer (b), and having a weight average molecular weight of 20,000 to 100,000, provided that the vinyl-based polymer (I) is excluded; a quinonediazide compound (III); and a compound (IV) represented by following formula (5). [In the formula, Y is a hydrocarbon group of 1 to 6 carbon atoms; l and m are each independently an integer of 1 to 3; n is 1 or 2; p and q are each independently 0 or 1.]. 

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Toyohashi, Japan

Hidetaka Nakagawara