Tdk Corporation

Hidetaka Kitamura

Dai Matsuoka

Tadashi Ogasawara

A chip shaped electronic device comprising an element body including zinc oxide material layers and internal electrode layers, wherein when assuming a minimum distance from an outermost side of the internal electrode layer in the stacking direction to a surface of the element body is 1 and measuring an ion intensity ratio of Li and Zn, (Li/Zn), in a range from the surface of the element body to a depth of (0.9&times;1) by a secondary ion mass spectrometry (SIMS), 0.001&lE;(Li/Zn)&lE;500. According to the invention, it is possible to provide a chip shaped electronic device, such as a multilayer chip varistor, not requiring glass coating or other insulative protective layer, being tolerant of temperature changes, capable of maintaining high resistance of an element surface even by reflow soldering, being highly reliable, and capable of being easily produced, and a method of producing the same.

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Tokyo, Japan

Hidetaka Kitamura