Hitachi Cable, Inc.

Hitachi Consumer Electronics Co., Ltd.

Hitachi Metals, Ltd.

Hitachi Aloka Medical, Ltd.

Hidetaka Kawauchi

Yoshinori Sunaga

Juhyun Yu

Kinya Yamazaki

Yoshiaki Ishigami

Isao Takahashi

Hiroki Katayama

Akihiro Hiruta

Shinichi Inoue

Tenpei Inoue

Masahiko Kobayashi

Hidenori Yonezawa

Masaki Ogura

Naoyuki Yamada

Tsuneaki Kawaguchi

Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Signal transmission device

A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

An object of the present invention is to provide a radioactive ray detector for enabling to reduce the parasitic capacity lower than that of the conventional art, which is generated between the semiconductor elements of the radioactive ray detectors neighboring with, and a radioactive ray detecting apparatus applying that therein. The radioactive ray detector, comprises a substrate, a first semiconductor element and a second semiconductor element, which are provided to face to each other with positioning the substrate therebetween, a first electrode pattern, which is electrically connected with the first semiconductor element on a surface facing to an opposite side of the substrate, and a second electrode pattern, which is electrically connected with the second semiconductor element on a surface facing to an opposite side of the substrate, wherein the first electrode pattern and the second electrode pattern are arranged not to overlap with each other, when seeing through the substrate in a direction of thickness thereof.

Radioactive ray detector and radioactive ray detecting apparatus

A radioactive ray detector card comprises semiconductor elements on a substrate, each having a plurality of first electrodes, provided on one of main surfaces thereof, and a second electrode, provided on other of main surfaces thereof; the substrate having first electrode wirings electrically connected with the plurality of first electrodes, and card edge portions, which transmit signals from the plurality of semiconductor elements to an external electric circuit; the second electrode corresponding to a second electrode identifier, for identifying the semiconductor elements; the first electrodes corresponding to first electrode identifiers, for identifying the plurality of first electrodes, respectively; and the first electrode wirings electrically connect between the first electrodes, corresponding to one of the first electrode identifiers on one semiconductor element of the plurality of semiconductor elements, and the first electrodes, corresponding to one of the same first electrode identifiers on the other semiconductor element.

Radioactive ray detector card

A transmission/reception optical module has an optical transmission subassembly, an optical reception subassembly, and a circuit boardwherein the circuit boardis formed into one member by a rigid/flexible substrate. Circuit board main bodies, and an optical reception subassembly fixation regionare formed by rigid regionsA,, andP. An area provided between the circuit board main bodyand the optical reception subassemblyis composed of a flexible regionP. A part of the circuit board main bodyis composed of a flexible region

Transmission/reception optical module

A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a support member disposed adjacent to the semiconductor element for supporting the substrate. The substrate includes a first end portion on which the semiconductor element is mounted, and a second end portion opposite the first end portion for disposing the support member. The support member includes a first support and a second support, and the first support and the second support each includes a protrusion and an engagement hole for engaging with the protrusion. The protrusion of the first support engages with the engagement hole of the second support to fix the first support and the second support such that the substrate is compressed and supported by the first support and the second support.

Radiation detector

A radiation detector stand has a first support having a plurality of first trenches to which a plurality of radiation detectors for detecting a radiation are inserted, and a second support arranged in parallel to the first support. The first trenches are arranged at a predetermined interval corresponding to an interval of arranging the radiation detectors. The second support has a plurality of second trenches to which the radiation detectors are inserted, and the second trenches are arranged at the predetermined interval.

Radiation detector stand

A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a flexible substrate including a connection pattern connected to an element electrode on an opposite side to the substrate of the semiconductor element. The semiconductor element is disposed on one surface of the substrate, and the flexible substrate is disposed on the opposite side to the substrate of the semiconductor element.

An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.

Optical fiber temperature sensing device

Radiation detector cards stand

An optical fiber temperature sensor has a sensing part composed of an optical fiber arranged at a temperature measurement point; a light source for injecting a light to the sensing part; a wavelength filter module for branching the Raman scattered light from the back scattered light generated at the sensing part; photoelectric detectors for detecting the Raman scattered light and a signal processing circuit for processing the electric signals from the photoelectric detectors, wherein the light source is a semiconductor laser having a wavelength bandwidth of 0.78 &#x3bc;m; the wavelength filter module has a longer wavelength side band pass filter for transmitting the Stokes light and a shorter wavelength side band pass filter for transmitting the anti-Stokes light; and the longer wavelength side band pass filter and the shorter wavelength side band pass filter do not allow the light having the wavelength band of the semiconductor laser to be transmitted.

Optical fiber temperature sensor

An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.

Optical transmission module

A mounting structure for electronic components is provided with a circuit board that has a step portion formed at one end portion thereof. The step portion is sandwiched by a lead of the electronic component so as to secure the lead to the step portion. The step portion is formed by perforating a region on one surface of the circuit board, and then peeling a part of the circuit board corresponding to the perforated region so as to reduce the thickness of the circuit board at the region.

Mounting structure for electronic components

An optical transceiver has: an optical subassembly that has a built-in chip portion and a receptacle portion; a board electrically connected to one end of the built-in chip portion; a housing that houses the optical subassembly and the board; and a holding member to hold the optical subassembly.

Growing community of inventors

Hitachi, Japan

Hidetaka Kawauchi