Jx Nippon Mining Metals Corporation

Hideta Arai

Atsushi Miki

Ryo Fukuchi

Satoru Morioka

Kohsuke Arai

Kaichiro Nakamuro

Yuki Ori

Toshiyuki Ono

Hajime Momoi

Naoki Higuchi

Kengo Kaminaga

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil comprises a copper foil, and

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 &#x3bc;m, a roughness Rz is 1.00 to 2.00 &#x3bc;m, a roughness Sq is 0.16 to 0.30 &#x3bc;m, a roughness Ssk is &#x2212;0.6 to &#x2212;0.35, a roughness Sa is 0.12 to 0.23 &#x3bc;m, a roughness Sz is 2.20 to 3.50 &#x3bc;m, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 &#x3bc;m, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device

Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180&#xb0; C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 &#x3bc;g/dmor more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 &#x3bc;g/dmor less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 &#x3bc;g/dmor less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 &#x3bc;m or less.

Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference &#x394;E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 &#x3bc;m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil

A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 &#x3bc;m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 &#x3bc;m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Copper foil for printed circuit

A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 &#x3bc;m or more.

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board

To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiOconversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.

Surface-treated copper foil

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

Printed wiring board, electronic device, catheter, and metallic material

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following &#x394;B (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference &#x394;E*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil &#x394;B (&#x394;B=Bt&#x2212;Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 &#x3bc;m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 &#x3bc;m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated copper foil comprising at least one surface treated surface with a color difference &#x394;E*ab of 40 or more based on JIS Z 8730, and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an end of the copper foil to a portion without the copper foil &#x394;B (&#x394;B=Bt&#x2212;Bb) of 40 or more, after lamination of the surface treated surface to a polyimide having a &#x394;B (PI) defined as above of 50 or more and 65 or less before being laminated to the copper foil, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil.

Surface treated copper foil and laminate using the same

A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of &#x2212;0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve:=(&#x394;&#xd7;0.1)/(1&#x2212;2)&#x2003;&#x2003;(1);

Provided is a copper-clad laminate obtainable by bonding a copper foil on which roughening treatment including copper-cobalt-nickel alloy plating is performed and a liquid crystal polymer to each other, wherein the copper-clad laminate is free from a roughening particle residue on a surface of the liquid crystal polymer resin after copper foil circuit etching. The copper-clad laminate obtainable by bonding a copper foil and a liquid crystal polymer to each other, wherein the copper foil includes a copper primary particle layer formed on a surface bonded to the liquid crystal polymer and a secondary particle layer formed on the primary particle layer and made from a ternary alloy including copper, cobalt, and nickel; the primary particle layer has an average particle size of 0.25 to 0.45 &#x3bc;m; and the secondary particle layer has an average particle size of 0.05 to 0.25 &#x3bc;m.

Growing community of inventors

Ibaraki, Japan

Hideta Arai