Nisshinbo Industries, Inc.

Nisshinbo Holdings Inc.

Ueda Japan Radio Co., Ltd.

Hideshi Tomita

Yasuo Imashiro

Norimasa Nakamura

Takahiko Ito

Satoshi Amano

Ikuo Takahashi

Takahiko Itoh

Takashi Suzuki

Kazuo Saito

Akira Yamaguchi

Tomoki Nakamura

Shigeo Kobayashi

Yoshitaka Saito

Nana Isomoto

The present invention provides a resin composition for an acoustic matching layer which maintains uniform dispersibility of a hollow filler, can suppress bubble trapping, and is excellent in moldability and handleability. The resin composition for an acoustic matching layer, comprises a resin, a hollow filler, and a thixotropy imparting agent, wherein the resin composition has a viscosity measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm at 25° C. of 1130 to 4000 Pa·s, and has a thixotropy index expressed by the ratio (V1/V2) between a viscosity (V1) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 0.3 rpm and a viscosity (V2) measured using a B-type viscometer with rotor No. 4 at a rotation speed of 1.5 rpm, at 50° C., of 3.0 to 5.0.

Resin composition for acoustic matching layer

The present invention is aimed to provide, as an acoustic lens propagating a sonic wave having a wavelength &#x3bb; of 100 &#x3bc;m or less, an acoustic lens capable of exhibiting excellent acoustic characteristics in response to the wavelength &#x3bb; of the sonic wave to be propagated and a production method thereof. The acoustic lens is an acoustic lensto be used for propagating a sonic wave having a wavelength &#x3bb; of 100 &#x3bc;m or less, wherein the acoustic lens contains a silicone resin and silica particles, an average primary particle diameter of the silica particles is 15 nm or more, and a particle diameter (D90) of 90% of a cumulative percentage in cumulative particle size distribution of the silica particles is less than &#x215b; of the wavelength &#x3bb; of the sonic wave to be propagated.

Acoustic lens and production method thereof, and acoustic wave probe

A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180&#xb0; bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.

Thermosetting polycarbodiimide copolymer

It is an object of the present invention to provide a composition for an acoustically matching layer, having sufficient mechanical strength to allow itself to be easily formed, and capable of giving an acoustically matching layer highly stable in characteristics over extended periods even under high temperature and high humidity conditions. The present invention provides a composition containing a carbodiimide resin for an acoustically matching layer, where the composition may further contain inorganic hollow bodies or inorganic hollow bodies and another reactive resin; a process for producing a formed article of an acoustically matching layer by curing and forming under heating the composition in a mold for the acoustically matching layer; and an ultrasonic transducer using the same composition and ultrasonic transducer using the same formed article.

Acoustically matching layer and composition thereof

A plasma etching electrode for dry etching devices for production of semiconductor devices. The plasma etching electrode is prevented from contamination with impurities, provides good thermal and electrical conductance and heat resistance at the joint between the electrode plate and pedestal (or supporting ring), and hence improves etching characteristics and silicon wafer yield. The highly heat-resistant plasma etching electrode includes an electrode plate of silicon which is supported by and uniformly joined to a pedestal by an adhesive. The pedestal is made of graphite. The adhesive includes an epoxy resin containing polycarbodiimide resin and carbon powder. A dry etching device including the electrode is also described.

Highly heat-resistant plasma etching electrode and dry etching device including the same

Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition

Resin-coated metal foil

A modified carbodiimide resin obtainable by reacting a carbodiimide resin comprising a repeating unit represented by the general formula: &mdash;(NCN&mdash;R )- wherein R represents a divalent organic group, with an aromatic diamine represented by the general formula: H N&mdash;R &mdash;NH wherein R represents a divalent organic group having a benzene ring, and a thermosetting resin composition comprising the modified carbodiimide resin and an epoxy resin.

Thermosetting resin composition

The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Adhesive film for semiconductor package

The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.

Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board

The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.

Method of adhering adherends

A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.

LCP bonding method

The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.

Film-shaped encapsulating agent for electronic parts

A modified carbodiimide resin obtainable by reacting a carbodiimide resin comprising a repeating unit represented by the general formula: &mdash;(NCN&mdash;R,)&mdash; wherein R,represents a divalent organic group, with an aromatic diamine represented by the general formula: H,N&mdash;R,&mdash;NH,wherein R,represents a divalent organic group having a benzene ring, and a thermosetting resin composition comprising the modified carbodiimide resin and an epoxy resin.

The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

Growing community of inventors

Chiba, Japan

Hideshi Tomita