Sharp Kabushiki Kaisha Corporation

Hideshi Koizumi

Toshio Hata

Tomokazu Nada

Kazunori Matsubara

Ayumi Yagi

Nobumasa Kaneko

Takuya Shigenobu

Masaki Kondoh

The color purities of blue-green light and yellow or yellow-green light are enhanced. A light emitting device () configured to emit at least blue-green light and yellow or yellow-green light includes a substrate (), an LED chip group, and a sealing resin part () collectively sealing the LED chip group, wherein the LED chip group at least includes a green LED chip (GB), a green LED chip (GY), a blue LED chip (B), and a red LED chip (R), and the green LED chip (GB) has a dominant wavelength shorter than a dominant wavelength of the green LED chip (GY).

Light emitting device

In a semiconductor laser apparatus, semiconductor laser devices are mounted on a loading face of a radiation base portion produced from a radiation material in a mount board, and the radiation base portion and a cap portion constitute an envelope surrounding the semiconductor laser devices. Further, the radiation base portion and interconnections formed on and an extending face of the radiation base portion constitute an external connection terminal. Therefore, heat generated by the semiconductor laser devices is efficiently transferred to the radiation base portion produced from a radiation material. Further, constituting the external connection terminal allows a leadless configuration to be implemented. Thus, a semiconductor laser apparatus which is sufficient in radiation characteristics and is capable of supporting a low-profile specification is provided.

Semiconductor laser and apparatus

A semiconductor laser device has a support body constructed of a disk-shaped section and a columnar body formed in a central portion of this disk-shaped section, one set of leads fit to this support body in an integrated manner, a semiconductor laser element mounted on a reference surface of the columnar body, and a wire for electrically connecting this semiconductor laser element with one of the leads. The disk-shaped section of the support body has an opening therethrough. The one set of leads are inserted through the opening, placed in position, and integrated with the support body via a resin block filling the opening.

Semiconductor laser device and fabricating method therefor

A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces. These curved outer surfaces are formed of arcs having the vertical optical path as the central axes, and are so formed that the curvature radiuses of the right and left arcs are different.

Growing community of inventors

Yamatotakada, Japan

Hideshi Koizumi