Seiko Instruments Inc

Hideshi Hamada

Yoshifumi Yoshida

Atsushi Kozuki

An electronic device includes an insulating base substrate having a through electrode, an electronic element provided on one surface of the insulating base substrate and connected to the through electrode, a lid provided on the one surface of the insulating base substrate, and an external electrode covering an end face of the through electrode that is exposed on another surface of the insulating base substrate different from the one surface thereof. The external electrode has a conductive film, a first electrolytic plating film provided on the conductive film, and a second electrolytic plating film provided on the first electrolytic plating film. The conductive film is provided on the exposed end face of the through electrode and on portions of the another surface of the insulating base substrate in the vicinity of the exposed end face of the through electrode.

Electronic device and method of manufacturing electronic device

An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

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Chiba, Japan

Hideshi Hamada