Kitagawa Industries Co., Inc.

National Institute of Advanced Industrial Science and Technology

Hideo Yumi

Tomohisa Kurita

Hiroki Kitano

Tatsuya Nakamura

Kenji Konda

Kimihiro Ozaki

Yasuhiro Kawaguchi

Akio Yamaguchi

Yasuo Kondo

Masaru Yagi

Takashi Mizuno

Toru Matsuzaki

Kenta Takagi

Makoto Kato

The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.

Heat conduction member, production method for heat conduction member, and heat conduction structure

A contact in one aspect of the present disclosure comprises a fixing portion, an elastic contact piece, and a pair of projecting tabs, which are formed as an integrated entity from a metal thin plate. The projecting tabs project from the fixing portion at positions on both sides of the elastic contact piece. A dimension of the elastic contact piece in a width direction, which matches the direction of an interval between the projecting tabs, is a first dimension. The projecting tabs are formed such that each projecting tab is a flat plate having the same thickness as the thin plate. The projecting tabs are arranged such that the thickness directions thereof are the same direction, in locations that have inner surfaces of the projecting tabs facing each other, and an interval between the inner surfaces is a second dimension greater than the first dimension.

Conductive contact including an elastic contact piece with protruding portions

A contact member according to one aspect of the present disclosure comprises: a thin plate member having spring characteristics and electrical conductivity. The thin plate member comprises: a joint portion having a joint surface to be joined to a first member; a contact portion contactable with a second member; and a connecting portion having a length component in a direction intersecting the joint surface, and having a first end continuous to the joint portion and a second end continuous to the contact portion. The connecting portion comprises a narrow portion having a smaller dimension in a width direction than a dimension around the narrow portion.

Contact member

An electromagnetic shielding member comprises: a shielding portion, including a metal material, for sealing an electronic component on an electronic circuit board, between the shielding portion itself and the electronic circuit board; a dielectric portion between a conductive portion of the electronic component, and the shielding portion, the dielectric portion including a dielectric material having a relative permittivity of 6 or more; and a laminated portion around the electronic component, the laminated portion being a laminate of the shielding portion and the dielectric portion.

Electromagnetic shielding member and electromagnetic shielding structure

In a thermoelectric conversion module, each of a p-type element and an n-type element is configured by aligning a plurality of particles in series and connecting the particles to each other. Around a connection part in which the particles are connected to each other, a protrusion is protruded. The protrusion has a shape of continuously extending around the entire periphery of the connection part. The protrusion may be partly interrupted, but in such a case, a circumferential length of one interrupted portion is less than one half of the periphery of the connection part.

Thermoelectric conversion element, manufacturing method for the thermoelectric conversion element, and thermoelectric conversion module

A surface mount clip including: a solder joint part in which a lower surface thereof is to be a solder joint surface to be soldered and connected to a conductor pattern on a printed circuit board. A pair of support parts are connected to the solder joint part and, when the solder joint part is soldered and connected to the printed circuit board, are supported in a position above the printed circuit board at an interval between the pair of support parts. The interval allows a conductive member, other than the printed circuit board, to be inserted therein. A resilient contact part, that is connected at least to one of the pair of support parts, is resiliently deformed and pressed by the conductive member, when the conductive member is inserted between the pair of support parts, and electrically connects the conductor pattern and the conductive member.

Surface mount clip

A screw has an outer diameter in a range of 0.3 mm to 1.4 mm. The screw includes resin and carbon fiber which is dispersed in the resin and has a fiber diameter in a range of 0.01 &#x3bc;m to 0.20 &#x3bc;m.

Screw

A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.

Contact and bonding structure of the contact

A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Contact

A conductive component includes a tubular body having at least one of at least one through-hole which penetrates the tubular body from outside to inside thereof; and at least one notch which is cut in from an edge of the tubular body, which are formed at least one predetermined portion on the tubular body. The tubular body includes a first portion, which includes a solder joint portion, and a second portion, which includes a contact portion. The first portion and the second portion are located on the opposite sides from one another with the at least one predetermined portion sandwiched therebetween. The tubular body further includes at least one spring portion which includes the at least one predetermined portion.

Conductive component

A surface mount contact member includes a metal base and a conductive coil spring. The metal base is provided with a nozzle suction surface to be sucked by a suction nozzle and a soldering surface that can be soldered. The soldering surface is faced downward when the nozzle suction surface is faced upward. The conductive coil spring is attached to the metal base in an electrically conductive manner with the nozzle suction surface being exposed to an inner peripheral side of the coil spring.

Surface mount contact member

Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Grounding terminal and mounting structure of the same on a printed circuit board

A conductive element having good solderability and the manufacturing method thereof. A metal wire having a circular section and tin-plated along its whole circumference is prepared and pressed by a pressing machine from the side directions until the metal wire becomes almost flat. By this, a strip of thin plate-like member is formed. Then, a conductive silicone base adhesive is applied to one surface (one pressed surface) of the plate-like member and dried. Thus, the conductive element comprising the plate-like member and the conductive elastomer joined to the pressed surface thereof is obtained.

Conductive element and manufacturing method thereof

The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Growing community of inventors

Kasugai, Japan

Hideo Yumi