Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Minolta Company, Ltd.

Matsushita Electric Co., Ltd.

Matushita Electric Industrial Co., Ltd.

Masaki Aoki Et Al.

Panasonic Intellectual Property Management Co., Ltd.

Hideo Torii

Eiji Fujii

Ryoichi Takayama

Atsushi Tomozawa

Masaki Aoki

Takeshi Kamada

Tohru Nakagawa

Taku Hirasawa

Akiko Murata

Satoru Fujii

Hideyuki Okinaka

Masumi Hattori

Ryuichi Murai

Hiroyuki Kawamura

Mitsuhiro Ohtani

Hiroyoshi Tanaka

Shigenori Hayashi

Yutaka Nishimura

Yasuhisa Ishikura

Katsuyoshi Yamashita

Takashi Inami

Takashi Hirao

Hideto Monji

Yoshihiro Tomita

Shinya Hasegawa

Hiroyuki Matsuba

Masayuki Sakai

Kiyoshi Kuribayashi

Nobuyuki Aoki

Masayuki Okano

Seishi Tomari

Hiroaki Nakashima

Kazunari Chikanawa

Keiichi Ochiai

Tetsuya Kamimoto

Mikie Kanai

Takahiro Kawashima

Tohru Saitoh

Satoru Yuhaku

Makoto Umetani

Isaku Kanno

Shoji Nakamura

Hideaki Komoda

Yasuhiko Horio

Hiroki Moriwake

Ikuo Ota

Hozumi Hirota

Toshio Ozawa

Ken Kamata

Eiji Fuji

Syunsuke Nishimura

Yasuko Nishimura

Emi Kawahara

A method for mounting an electronic circuit-constituting member on a substrate. The method includes preparing a substrate having a surface comprising a liquid-attracting first region and a liquid-repelling second region that surrounds the first region. The method also includes bringing water into contact with the surface of the substrate so as to dispose said water only on the said first region. The method further includes subjecting said substrate to a member-containing liquid that includes an organic solvent where an electronic circuit-constituting member are dispersed in the organic solvent to move said electronic circuit-constituting member to said water disposed on the said first region. The surface of the member is chemically modified with a silane coupling agent including a group with a C&#x2014;Cl bond. Also, the method includes removing the water and the organic solvent from the surface of the substrate to mount said electronic circuit-constituting member on said substrate.

Method of mounting electronic circuit constituting member and relevant mounting apparatus

An ink jet head unit including a head () in which a plurality of nozzle arrays () are formed. Each of the nozzle arrays has a number of nozzle holes, and ink can be ejected from the nozzle holes. The head () is mounted on the head base, and flat cables () are connected at one end to mounting parts (), which are interposed between a first pair of the nozzle arrays () and a second pair of the nozzle arrays (). The flat cables are flexibly formed by covering transmission wires with an insulation film. The flat cables are connected to the head to transmit ink ejection signals for driving the head.

Ink jet head unit and ink jet recording apparatus mounted with the same

According to a method of the present invention for manufacturing a semiconductor piece, at least two semiconductor layers () are first formed on a substrate () by stacking a sacrificial layer () and the semiconductor layer () on the substrate () in this order and repeating this stacking. Next, the semiconductor layers () are divided into pieces by etching part of the sacrificial layers () and part of the semiconductor layers (). Then, the pieces are separated from the substrate by removing the sacrificial layers ().

Method for producing semiconductor chip, and field effect transistor and method for manufacturing same

The first object of the present invention is to provide a PDP with improved panel brightness which is achieved by improving the efficiency in conversion from discharge energy to visible rays. The second object of the present invention is to provide a PDP with improved panel life which is achieved by improving the protecting layer protecting the dielectrics glass layer. To achieve the first object, the present invention sets the amount of xenon in the discharge gas to the range of 10% by volume to less than 100% by volume, and sets the charging pressure for the discharge gas to the range of 500 to 760 Torr which is higher than conventional charging pressures. With such construction, the panel brightness increases. Also, to achieve the second object, the present invention has, on the surface of the dielectric glass layer, a protecting layer consisting of an alkaline earth oxide with (100)-face or (110)-face orientation. The protecting layer, which may be formed by using thermal Chemical Vapor Deposition (CVD) method, plasma enhanced CVD method, or a vapor deposition method with irradiation of ion or electron beam, will have a high sputtering resistance and effectively protect the dielectrics glass layer. Such a protecting layer contributes to the improvement of the panel life.

Method of producing plasma display panel with protective layer of an alkaline earth oxide

A mounting method comprising the steps of (A) disposing first liquid () on first region () provided on one principal surface of substrate (); (B) bringing member-containing liquid () containing second liquid () and at least one member () into contact with the first liquid () disposed on the first region (); and (C) removing the first liquid () and the second liquid () from the one principal surface to thereby dispose the member () on the first region (). The first liquid () is substantially not dissolved in the second liquid (). The wettability of the first liquid () with respect to the surface of the member () is higher than that of the second liquid ().

A piezoelectric element includes two electrode films and a layered piezoelectric film which is sandwiched between the electrode films and made of two thin piezoelectric films each having preferred orientation along the (111) plane. The two thin piezoelectric films are aggregates of columnar grains, respectively, which are continuously linked to each other. The columnar grains of the second thin piezoelectric film have a larger average cross-sectional diameter than the columnar grains of the first thin piezoelectric film. The ratio of the thickness of the layered piezoelectric film to the average cross-sectional diameter of the columnar grains of the second thin piezoelectric film is 20 to 60 inclusive.

Piezoelectric element, inkjet head, angular velocity sensor, methods for manufacturing them and inkjet recording device

A mounting method of the present invention includes the steps of: (I) disposing a first liquid in a first region provided on one principal surface of a substrate; (II) bringing a pillar-like member as an anisotropically-shaped member, disposed on one principal surface of a transfer substrate in a predetermined orientation, into contact with the first liquid disposed in the first region, so as to move the pillar-like member to a region of the first liquid; and (III) removing the first liquid from the substrate.

Method for mounting anisotropically-shaped members

Plural nozzle arrays of which each comprises plural nozzle holes () from which ink is ejected are arranged slantingly in a main scanning direction. A distance between a first arbitrary nozzle hole (-) and a second nozzle hole (-), in a nozzle array adjacent to the array to which this first nozzle hole (-) belongs, which is adjacent to the first nozzle hole (-), and a distance between the first nozzle hole (-) and a third nozzle hole (-), in the nozzle array to which the second nozzle hole (-) belongs, which is further adjacent to the first nozzle hole (-) are different from each other.

Nozzle head, line head using the same, and ink jet recording apparatus mounted with its line head

In a piezoelectric element, an adhesive layeris provided on a substrate, a first electrode layermade of a noble metal containing titanium or titanium oxide is provided on the adhesive layer, and an orientation control layerthat is preferentially oriented along a (100) or (001) plane is provided on the first electrode layer. In the vicinity of a surface of the orientation control layerthat is closer to the first electrode layer, a (100)- or (001)-oriented region extends over titanium or titanium oxide located on one surface of the first electrode layerthat is closer to the orientation control layer, and the cross-sectional area of the region in the direction perpendicular to the thickness direction gradually increases in the direction away from the first electrode layertoward the opposite side. Further, a piezoelectric layerthat is preferentially oriented along a (001) plane is provided on the orientation control layer

Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus

A piezoelectric elementincludes a lower electrode, a piezoelectric filmand an upper electrodestacked in this order. The surface of the upper electrodeof the piezoelectric elementis exposed to a zirconium compound

Piezoelectric element, ink-jet head with same, and their manufacturing methods

A lead content in a piezoelectric thin film () of a piezoelectric element () is made smaller as compared to stoichiometric composition. More specifically, the piezoelectric thin film () is made of lead zirconate titanate expressed as Pb(ZrTi)O(0&#x3c;s&#x3c;1) or lead-zirconate-titanate-based oxide expressed as (PbA)(ZrTiB)O(0&#x3c;s&#x3c;1, 0&#x3c;t&#x3c;1-s) where A is a substitutive metal ion in an A-site in the perovskite crystalline structure and B is a substitutive metal ion in a B-site in the perovskite crystalline structure. The value of x, which indicates a deficiency in Pb content in each composition, is more than 0 but not more than 0.15.

Piezoelectric element and method for manufacturing the same, and ink jet head and ink jet recording apparatus using the piezoelectric element

A first electrode thin film is formed on an upper surface of the oxygen ion conductive thin film so as to have a through hole. A resistor is formed on part of the upper surface of the oxygen conductive thin film located in the through hole. Thus, the oxygen ion conductive thin film can be directly heated by the resistor, so that oxygen ions can be speedily transferred with a low power. Therefore, the oxygen ion conductivity of the oxygen ion conductive thin film can be improved.

Oxygen ion conductor device, method for fabricating oxygen ion conductor device, and oxygen concentration control system

A piezoelectric element includes a first electrode film; a piezoelectric layered film including a first piezoelectric thin film formed on the first electrode film and a second piezoelectric thin film formed on the first piezoelectric thin film; and a second electrode film formed on the second piezoelectric thin film. Each of the first and second piezoelectric thin films is an aggregate of columnar grains grown unidirectionally along the thickness direction of the piezoelectric layered film. The Pb content of the first piezoelectric thin film is smaller than the Pb content of the second piezoelectric thin film. A columnar grain of the second piezoelectric thin film has a larger average cross-sectional diameter than an average cross-sectional diameter of a columnar grain of the first piezoelectric thin film. A ratio of the thickness of the piezoelectric layered film to the average cross-sectional diameter of the second piezoelectric thin film is not less than 20 and not more than 60.

Piezoelectric element, method for fabricating the same, inkjet head, method for fabricating the same, and inkjet recording apparatus

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Osaka, Japan

Hideo Torii