Canon Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Stanley Electric Co., Ltd

Nec Corporation

Ajinomoto Co., Ltd.

Nittetu Chemical Engineering Ltd.

Hideo Tamura

Koichi Omata

Kousuke Kubo

Ryoji Oohashi

Yoshiyuki Imanaka

Takaaki Yamaguchi

Yoshiaki Sugizaki

Akihiro Kojima

Tetsuro Komatsu

Masayuki Ishikawa

Hideki Shibata

Yuji Tamaru

Yuuji Tamaru

Masahiro Kanai

Toshio Negishi

Yohei Osuki

Yoshinori Tagawa

Noboru Toyama

Taichi Yonemoto

Yusuke Miyamoto

Yuichi Sonoda

Kenji Fujii

Akira Sakai

Junichi Kobayashi

Keiji Watanabe

Yasushi Fujioka

Hiroyuki Murayama

Suguru Taniguchi

Atsushi Yasuno

Haruki Kurihara

Yasuyoshi Takai

Kozo Arao

Kazuaki Shibata

Hidetoshi Tsuzuki

Takaharu Kondo

Akiya Nakayama

Hiroaki Oshio

Hiroshi Shimoda

Masumitsu Iwata

Hiroshi Ohno

Hirokazu Tanaka

Kazuo Suzuki

Nobuyuki Hirayama

Ryo Kasai

Akiko Suzuki

Takuya Hatsui

Yosuke Akimoto

Keiichi Murakami

Aya Yoshihira

Yuzuru Ishida

Tatsuo Furukawa

Kazuhito Higuchi

Susumu Obata

Tamaki Sato

Masahiko Yamamoto

Masataka Shiratsuchi

Jun Kawai

Kenji Matsumoto

Shinetsu Fujieda

Shotaro Okabe

Tadashi Hori

Isamu Horiuchi

Tomonao Takamatsu

Yasutomo Watanabe

Mitsuaki Kato

Kuniaki Konno

Yuichiro Yamamoto

Masafumi Takimoto

Takeru Yasuda

Toshihide Takahashi

Tomoko Kudo

Nozomu Takahashi

Tsubasa Funabashi

Tatsuoki Kono

Hidefumi Yasuda

Hiromichi Hayashihara

Kiyomitsu Ishikawa

Kazuaki Ootsuka

Mitsunori Toshishige

Reiji Ono

Hitomi Sano

Isao Ogawa

Tomio Nakaya

Toshimi Kamikawa

Yoichi Shimoi

Takao Suganuma

Shin Sakamoto

Masamichi Yoshinari

Masaomi Okazaki

Shingo Otobe

Hiroo Sakai

Kenji Matumoto

Minoru Sagara

Masami Yamaguchi

Shunichi Ishikawa

A recording element board has a plurality of heat-generating resistor elements arranged in a row and each of the plurality of heat-generating resistor elements comprises a heat-generating resistor layer and first and second pairs of electrodes connected to the heat-generating resistor layer. The first and second pairs of electrodes contact the heat-generating resistor layer at the opposite surfaces thereof to each other. The first pair of electrodes is formed as vias, while each surface of the second pair of electrodes is inclined so as to gradually reduce the thickness thereof toward the end thereof.

Recording element board, liquid ejection apparatus and method of manufacturing recording element board

A print element substrate comprises: a plurality of heaters configured to cause discharge of droplets; a pad array in which a plurality of pads configured to do electrical connection from an outside are arranged; and a plurality of resistance monitor elements configured to measure resistance values of the plurality of heaters, wherein the plurality of resistance monitor elements are arranged along a direction of the pad array.

Print element substrate, method of manufacturing print element substrate, and method of manufacturing printhead

A print element substrate, comprises: a heater layer; a wiring layer that is connected to the heater layer and is for causing the heater layer to generate heat; an insulating layer arranged on the wiring layer; an anti-cavitation layer arranged on the insulating layer that is for protecting the insulating layer; and a switch that has a control terminal that is pulled-down to a ground, and causes the anti-cavitation layer and the ground to have an electrical connection when the control terminal is in a high-level state.

Print element substrate, printhead, and printing apparatus

In one embodiment, an illumination device includes a light-guiding unit having a light output surface which outputs light and a back surface facing the light output surface, wherein the light-guiding unit has a curved surface in a region of the back surface farther than a first position on the back surface that is away by a first distance from an axis passing the light output surface and the back surface, and a rough surface in a region of the light output surface farther than a second position on the light output surface that is away by a second distance from the axis in a same direction as a direction from the axis toward the first position, and where an intersection of the axis and the back surface is an origin point, and a direction of the axis from the back surface to the light output surface is positive, a normal line of the curved surface intersects with the axis at the positive side of the axis, and an angle formed by a normal line vector at the second position in a direction toward the light output surface from the back surface of the light output surface and a vector in a direction from the curved surface to the second position is equal to or more than a critical angle.

Illumination device and light-guiding member

An element substrate for a liquid ejecting head includes a substrate, an element forming layer on the substrate, and a discharge port forming member formed of an insulating member on the element forming layer. The element forming layer includes an energy generating element configured to provide energy to a liquid for ejection. The discharge port forming member includes a discharge port forming surface having discharge ports through which the liquid is ejected and an exterior side surface positioned between the discharge port forming surface and the element forming layer. The exterior side surface has a first edge facing the element forming layer. The element substrate further includes a conductive layer disposed between the first edge and the element forming layer and grounded.

Element substrate for liquid ejecting head and wafer

A recording-element substrate includes a substrate including a base member, a pair of electrodes, a heating element formed of a thermal resistor layer between the electrodes, a surface on which an electroconductive film coating the heating element has been formed, and an insulating film between the heating element and the electroconductive film and a flow-path-forming member including walls forming a liquid flow path toward the heating element while being disposed on the substrate's surface side. The substrate includes an electric connecting portion in contact with the electroconductive film to connect the electroconductive film with the base member. The shortest distance between the electric connecting portion and a portion where an angle formed by the walls is 120 degrees or smaller when viewed from a direction orthogonal to the surface is smaller than that between a boundary between the electrodes and the heating element and the portion.

Recording-element substrate, recording head, and recording apparatus

According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.

Semiconductor light emitting device and method for manufacturing same

A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

Light emitting device and method for manufacturing same

According to one embodiment, a light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a first insulating layer, a p-side interconnect layer, an n-side interconnect layer and a second insulating layer. The semiconductor layer includes a first surface, a second surface opposite to the first surface, and a light emitting layer. The p-side electrode is provided on the second surface in a region including the light emitting layer. The n-side electrode is provided on the second surface in a region not including the light emitting layer. The p-side interconnect layer includes a p-side external terminal exposed from the second insulating layer at a third surface having a plane orientation different from a plane orientation of the first surface and a plane orientation of the second surface. The n-side interconnect layer includes an n-side external terminal exposed from the second insulating layer at the third surface.

Light emitting device, light emitting module, and method for manufacturing light emitting device

When protective portions are independently provided for each energy generation element, a leakage current inspection between the protective portions and the energy generation elements cannot be performed at once. Therefore, there is a concern that the inspection in manufacturing a substrate for liquid ejection head requires time. Therefore, the substrate for liquid ejection head is manufactured by performing a leakage current inspection between a connecting portion that is electrically connected to plurality of protective portions and a terminal to which the plurality of energy generation elements are connected, and thereafter removing the connecting portion.

Method for manufacturing substrate for liquid ejection head and method for manufacturing liquid ejection head

A print head is provided that well preserves ink characteristics upon printing by way of performing effective ink preliminary heating. The print head has heaters and ejection openings formed at locations corresponding to the heaters. Viewed from the side from which ink is ejected, a sub-heater is established in the print head between the ink supply port and the print elements so as to surround the ink supply port.

Liquid ejection head

Performing a high-speed recording operation using a slender liquid discharge head substrate causes an uneven temperature distribution for each energy generating element because the center portion of the liquid discharge head substrate is more liable to accumulate heat than the end portion thereof, which may affect the quality of a recorded image. For this reason, the surface of the energy generating element which contacts liquid is separated into a first region and a second region in which a protection film is thicker than the one in the first region, and the area in the first region for the element positioned at the end portion of the array of the elements is made greater than that in the first region at the center portion thereof.

Liquid discharge head substrate and liquid discharge head

A liquid-discharging recording head includes first and second substrates each having an energy generating element and a supply port, and a support member on which the substrates are arranged. The first substrate is provided on one side in a longitudinal direction of the support member, and the second substrate is provided on an other side in the longitudinal direction of the support member. A driving circuit configured to drive the energy generating element is provided in a larger region between an end of a supply port in the first substrate on the other side in the longitudinal direction and an end of the first substrate on the other side and in a larger region between an end of a supply port in the second substrate on the one side in the longitudinal direction and an end of the second substrate on the one side.

Liquid-discharging recording head

Growing community of inventors

Kawasaki, Japan

Hideo Tamura