Fujitsu Corporation

Kabushiki Kaisha Toshiba

Hitachi Seiko, Ltd.

Hideo Sato

Hiroshi Takahashi

Masashi Takenaka

Junichiro Hiyoshi

Shiro Yoda

Mitsuru Sato

Akira Okada

Tamio Otani

Norio Michigami

Kunio Saitoh

Yuzi Obara

A semiconductor device includes a substrate; and a chip formed on the substrate and electrically connected to the substrate by a wire. The chip includes a wiring layer electrically connected to the wire; and a protective layer formed on the wiring layer. The wiring layer includes a wiring portion having the protective layer formed in an upper layer thereof and being electrically connected to another layer at a lower layer thereof; a bonding portion connected to one end of the wire at an exposed surface thereof, the exposed surface not having the protective layer formed in an upper layer thereof; and a connecting portion configured to join the wiring portion and the bonding portion. The connecting portion includes an etched portion formed by digging out the wiring layer.

Semiconductor device

A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.

Fingerprint sensor package

A tape carrier package formed by a TAB technique is provided. This tape carrier package includes a semiconductor chip and a TAB tape. The TAB tape has a rectangular device hole in which the semiconductor chip is situated, and inner leads extending inward in the device hole and bonded to the electrode bumps of the semiconductor chip. The inner leads (corner leads) at each corner of the device holes are reinforced by reinforcing leads.

Tape carrier package

A semiconductor device having a semiconductor chip on a TAB (Tape Automated Bonding) tape with high reliability is provided. The semiconductor device of the present invention includes a TAB tape which has a base film provided with a device hole in a position where a semiconductor chip is mounted, a wiring pattern whose end portions constitute inner leads connected to the semiconductor chip and terminal connecting portions provided with solder balls, and a photo-solder resist which protects the wiring pattern. Chamfered portions which relieves internal residual stress caused in the photo-solder resist due to the difference in thermal expansion coefficient between the base film and the photo-solder resist are formed at locations on the photo-solder resist facing the corners of the device hole.

An apparatus for taking out printed circuit boards, comprises a pin extracting device for extracting a plurality of pins erectly provided on a workpiece including printed circuit boards and a lower plate both of which are laminated, a reversing device for reversing the workpiece, a lower plate discharging device for discharging the lower plate from the workpiece, and a printed circuit board recovering device for recovering the printed circuit boards. The apparatus is capable of automatically taking out the printed circuit boards from the workpiece discharged from a perforator.

Growing community of inventors

Kawasaki, Japan

Hideo Sato