Hitachi-high-technologies Corporation

Hitachi, Ltd.

Hoya Corporation

Hitachi High-tech Science Corporation

Raytex Corporation

Hideo Sakai

Yasutaka Toyoda

Ryoichi Matsuoka

Hiroki Kawada

Masayoshi Takahashi

Yuichi Sakurai

Masaaki Maeda

Yoshihiro Tawara

Satoshi Tomimatsu

Katsuhiro Sasada

Yosuke Suzuki

Tsuyoshi Oonishi

Takeo Yoshimi

Naoyuki Nohara

Tetsuya Mizutani

A device includes a catalog storage unit that stores a catalog having versatility; a catalog control unit that specifies the catalog corresponding to a target machine tool to be subjected to state determination based on machine tool information including an item of facility type and acquires the catalog from the catalog storage unit; a feature quantity extraction unit that extracts a feature quantity from sensor data detected from the target machine tool; a sensor data processing unit that performs state determination of the target machine tool based on the feature quantity distribution included in the acquired catalog and the feature quantity extracted from the sensor data; a feature quantity tuning unit that performs tuning of the feature quantity distribution by mapping the extracted feature quantity to the feature quantity distribution; and a catalog updating unit that updates the catalog based on the feature quantity distribution after tuning.

Facility state determination device, facility state determination method, and facility management system

A state identification device includes: a feature amount extraction unit that extracts a feature amount from physical data of a machine tool unit which shifts to a plurality of operation states; a feature amount storage unit in which a region is provided as a storage destination of the extracted feature amount for each of the plurality of operation states to which the machine tool unit shifts; a similarity calculation unit that calculates a similarity between the extracted feature amount and a feature amount stored in the feature amount storage unit; a state determination unit that determines an operation state of the machine tool unit based on the calculated similarity; and a storage destination determination unit that determines the region serving as the storage destination of the extracted feature amount based on a determination result of the state determination unit.

State identification device, state identification method and mechanical device

The presently disclosed subject matter provides a pattern measurement method and device for achieving highly accurate measurement in the depth direction of a pattern. The method involves a focused ion beam irradiated to form an inclined surface in a sample area; a field of view of a SEM set to include the boundary between the inclined surface and a sample surface; and an image of the field of view obtained on the basis of a detection signal. Such an acquired image is used to specify a first position, the boundary between inclined surface and non-inclined surface, and a second position, the position of a desired deep hole or deep groove positioned within the inclined surface. The pattern dimension in a height direction is determined on the basis of the distance in the sample surface direction between the first position and second position and the angle of the inclined surface.

Pattern measurement method and pattern measurement device

There is provided a control device for controlling a charged particle beam apparatus, wherein the beam apparatus comprises a workpiece stage having at least two turning axes which are not parallel to each other and an irradiation unit, and the control device comprises an angle calculation unit that based on a direction of a first processing in which a processed surface having a normal line not parallel to any of the turning axes is generated in the workpiece by the irradiation unit and a direction of a second processing to be processed by the irradiation unit from a direction different from the direction of the first processing with respect to the processed surface to be generated by the first processing, calculates turning angles about the turning axes that changes the direction of the stage from the direction of the first processing to the direction of the second processing.

Control device, charged particle beam apparatus, program and method for producing processed product

A method of manufacturing a glass substrate for a magnetic disk includes a polishing step of polishing a main surface of a glass substrate by sandwiching the glass substrate between a pair of surface plates each having a polishing pad on its surface and by supplying a polishing liquid containing polishing abrasive particles between the glass substrate and the polishing pads. In the polishing step, the polishing liquid and each polishing pad are adjusted so that the friction coefficient falls in a range of 0.02 to 0.05.

Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk

In a magnetic disk glass substrate manufacturing method, a main surface of a glass substrate is polished using a polishing liquid containing colloidal silica abrasive particles as polishing abrasive particles and a surface plate with a polishing pad, then the glass substrate is brought into contact with a liquid containing a coagulant so that the colloidal silica abrasive particles are coagulated, and then the colloidal silica abrasive particles coagulated are removed.

Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.

Pattern generating apparatus and pattern shape evaluating apparatus

An edge flaw detection device includes an elliptical mirror having a mirror surface on the inside thereof and having a cutout that allows an object to be inserted therethrough formed at the apex thereof, a light-emitting unit that radiates coherent light toward an edge of the object arranged in the vicinity of a first focal position of the elliptical mirror, a photo detector that is arranged in a second focal position of the elliptical mirror, and a light-shielding member that shields low-order diffracted light that is reflected regularly. The light-emitting unit is moved in the thickness direction of the object by a moving member so that the light-emitting unit can radiate the coherent light in a different radiation range in the thickness direction at the edge of the object.

Edge flaw detection device

In forming a silicon nitride film by the low-pressure CVD method using a silane gas and ammonia, the reaction pressure is set to lie over a range of from about 0.05 to about 0.25 Torr, enabling a silicon nitride film to be formed, of uniform thickness, highly efficiently even on large wafers, and maintaining high yield, improved uniformity and good quality as a whole without decreasing the film-forming efficiency. Preferably, the reaction pressure is maintained over a range of from 0.1 to 0.2 Torr to further increase the efficiency, while preferably maintaining the temperature over a range of from 700.degree. to 1000.degree. C.

Growing community of inventors

Tokyo, Japan

Hideo Sakai