The Furukawa Electric Co., Ltd.

Hideo Nishikubo

Hidemichi Fujiwara

Takuya Harada

Yusuke Yamada

Nobumitsu Yamanaka

Takashi Unno

Kazuhiro Takashiba

Tomohiro Ishii

Shunji Masumori

A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

Conductive connecting member and manufacturing method of same

In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).

Fine particle dispersion and method for producing fine particle dispersion

A method for producing a fine particle dispersion includes the steps of reducing a metal ion to form a fine particle dispersion aqueous solution; adding an aggregation accelerator into the fine particle dispersion aqueous solution so that agglomerated or precipitated fine particles are separated to obtain fine particles; and re-dispersing the fine particles into an organic solvent containing an organic solvent having an amide group, a low boiling point organic solvent having a boiling point between 20&#xb0; C. and 100&#xb0; C. at a normal pressure, and an organic solvent having a boiling point higher than 100&#xb0; C. at a normal pressure and containing an alcohol and/or a polyhydric alcohol.

Method for producing fine particle dispersion and fine particle dispersion

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Tokyo, Japan

Hideo Nishikubo