Kansai Paint Company, Ltd.

Other

Mitsui Chemicals, Inc.

Hideo Kogure

Genji Imai

Naozumi Iwasawa

Heihachi Murase

Osamu Isozaki

Toshiaki Nagano

Daisuke Kojima

Jun Akui

Tetsu Maki

Yukari Takeda

Kenichi Sugimoto

Keisuke Takuma

Tsutami Misawa

Akira Ogiso

Takeshi Tsuda

Masafumi Kume

Taizo Nishimoto

Hisashi Tsukahara

Kiyoshi Nanishi

Takeya Hasegawa

Koichi Tamura

Keisuke Naruse

Kengo Ohnishi

Hiroshi Kuriyama

Hiroyuki Honma

Fumihiko Nakakita

Hitoshi Ito

An inorganic film-forming coating composition prepared by adding a basic compound (B) to a titanium-containing water based solution (A) obtained by reacting a hydrogen peroxide water with at least one titanium compound selected from the group consisting of a hydrolizable titanium compound, a low condensation product of the hydrolizable titanium compound, titanium hydroxide and a low condensation product of the titanium hydroxide; and an inorganic film-forming method by use of the coating composition.

Coating material for inorganic-film formation and method of forming inorganic film from the coating material

A liquid or a solid positive type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm, wherein an absorbancy of an unexposed film formed from this composition is 0.5 or less within the range of the maximum wavelength &plusmn;30 nm selected from the range of the maximum wavelength of the safelight; and a method for forming a resist pattern is also disclosed which comprises (1) a step of applying a positive type photosensitive resin composition onto a substrate to form a photosensitive film thereon, (2) a step of exposing the photosensitive film so as to obtain a desired pattern, and (3) a step of performing a developing treatment to form a resist pattern, wherein at least one step of the steps (1) to (3) is carried out under the irradiation circumstance of the safelight having a high spectral luminous efficiency in which the maximum wavelength of an emission spectrum of a light source is within the range of 500 to 620 nm.

Positive type photosensitive resin composition and method for forming resist pattern

Method of forming pattern

Method of forming conductive pattern

Liquid photocurable composition, water-based photocurable composition and resist pattern-forming method by use of the same

Photosensitive resin composition

An organic solvent based photocurable resist composition containing a photopolymerizable polyurethane compound having a repeating unit represented by the following formula: B&mdash;&lsqb;X&rsqb;,&lsqb;Y&rsqb;,&mdash;B, where X is represented by the formula:

Organic-solvent-based photocurable resist composition and resist pattern-forming method

Positive type electrodeposition photoresist compositions and pattern formation process

A negative type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm and a large spectral luminous efficiency; the composition being a liquid or a solid resin composition containing a photocurable resin, a photoreaction initiator and if necessary, a photosensitizing dye; an absorbancy of an unexposed film formed from this composition being 0.5 or less within the range of the maximum wavelength .+-.30 nm selected from the range of the maximum wavelength of the safelight. By the use of this negative type photosensitive resin composition, it is possible to form a resist pattern which is excellent in safe operativity, operational efficiency, the quality stability of products, and the like.

Negative type photosensitive resin composition and method for forming

An excellently thermostable visible light-sensitive composition comprising (A) a polymer having carboxyl group(s) or a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A') a polymer having hydroxyphenyl group(s); (B) a compound having at least two vinyl ether groups per molecule, (C) a compound, which generates an acid when irradiated with a visible light; and (D) a sensitizing dye, and a process for pattern formation using such a composition are disclosed.

Visible light-sensitive compositions and pattern formation process

A visible light curable resin composition containing a photocurable resin, a photoreaction initiator and a photosensitizer having the formula (1). The composition has a very high sensitivity to a general-purpose visible light laser, so that a high-speed scanning exposure is possible by the laser, and an extremely fine high resolution can be obtained. In addition, the composition can be used for coating or printing under safelight irradiating conditions and under bright circumstantial conditions without any thickening of the composition, and hence the composition can exert excellent noticeable effects in points of safe operativity, operational efficiency and the stability of products. Formula (1) is as follows: ##STR1## wherein rings X.sub.1 and X.sub.2 are each an optionally substituted pyrrole ring; Y is H, CN, optionally substituted alkyl, aralkyl, aryl, heteroaryl or alkenyl group; and Z.sub.1 and Z.sub.2 are halogen, optionally substituted alkyl, alkoxy, alkylthio, aralkyl, aralkyloxy, aryl, aryloxy, arylthio, heteroaryl, heteroaryloxy or heteroarylthio group, provided that at least one of substituents on the pyrrole rings X.sub.1 and X.sub.2, groups Z.sub.1 and Z.sub.2 is the alkoxy, aralkyloxy or aryloxy group.

Photosensitizer, visible light curable resin composition using the same,

The present invention provides a visible laser-curable photosensitive composition wherein a photocuring resin having photosensitive group which is crosslinkable or polymerizable upon light exposure, is mixed with a photopolymerization inititor system consisting of a coumarin type pigment of particular structure and a titanocene compound. This composition has an unexpectedly high sensitivity to visible laser.

Visible laser-curable composition

The present invention provides a visible laser-curable resist composition which contains at least one radical-protecting compound selected from a phosphorous acid ester compound and an aromatic compound having N,N-dimethylamino group bonded to the carbon atom forming the aromatic ring and which is free from the hindrance of curing caused by deactivation of radical by oxygen and has excellent curability, and a process for formation of a resist pattern using the above composition.

Photopolymerizable composition

A positive type anionic electrodeposition photoresist composition comprising, as a main component, a dispersion obtained by neutralizing, with a base, a mixture comprising: (A) an acrylic resin containing carboxyl group(s) and hydroxyl group(s), (B) a vinylphenol resin containing a hydroxystyrene unit in an amount of at least 25% by weight based on the resin, and (C) an ester between a polyhydroxybenzophenone and 1,2-naphthoquinone diazide sulfonic acid or benzoquinone diazide sulfonic acid, and dispersing the resulting neutralization product in water. This composition is superior in running stability during electrodeposition and is useful for formation of highly reliable resist pattern or conductor pattern.

Positive type anionic electrodeposition photo-resist composition and

Growing community of inventors

Atsugi, Japan

Hideo Kogure