Tokyo Ohka Kogyo Co., Ltd.

Kanto Gakuin University Surface Engineering Research Institute

Kanto Gakuin School Corporation

Other

Kanto Kasei Co., Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Tanaka Chemical Corporation

Jcu Corporation

Toyota Jidsoha Kabushiki Kaisha

Facility Ltd.

Toyota Jidosha Kabushiki Kaisha

Hideo Honma

Koichi Misumi

Mitsuhiro Watanabe

Koji Saito

Tomoyuki Fujinami

Satoru Shimizu

Osamu Sasaki

Kunihiro Ikari

Takeshi Usui

Atsushi Kawahara

Tsutomu Takamura

Mamoru Shimakawa

Kazuhiro Takeda

Yoshitaka Terashima

Christopher Cordonier

Nobuo Ebina

Shinji Hayashi

Akira Teranishi

Taiji Nishiwaki

Toshiki Sasabe

Yoshiaki Suzuki

Yasuhiro Matsumoto

Masatsugu Nakanishi

Takeshi Bessho

Shigeru Suzuki

A non-cyanide gold plating bathcontains gold ions and a compound represented by the following chemical formula (chem 1): 

Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath

A battery having high output voltage, high energy density and excellent charge and discharge cycle characteristics is achieved through the use of one of the following negative electrode base members as a negative electrode base member for lithium ion secondary batteries: a negative electrode base member where a metal film is formed on a support having an organic film; such a negative electrode base member where the surface layer of the organic film is covered with a metal oxide film; a negative electrode base member where a metal film is formed on a support having a composite film formed from a composite film-forming material containing an organic component and an inorganic component; and a negative electrode base member where a silica coating is formed, on a support having a photoresist pattern, from a silica film-forming coating liquid and a metal film is formed on the support after removing the photoresist pattern.

Negative electrode base member

An anode substrate which enables achievement of a battery having a high output voltage and a high energy density, and being superior in charge and discharge cycle characteristics; a secondary cell in which the anode substrate is used; a resin composition for use in forming the anode substrate; and a method for producing the anode substrate are provided. According to anode substrateincluding metal filmformed on supportprovided with patterned organic filmmolded by a thermal imprint process or a photoimprint process, a battery having a high output voltage and a high energy density, and being superior in charge and discharge cycle characteristics can be provided.

Anode substrate

The present invention aims to realize a battery having high output voltage, high energy density and excellent charge and discharge cycle characteristics through a constitution different from those of conventional batteries. Specifically, one of the following negative electrode base members is used as a negative electrode base member for lithium ion secondary batteries: a negative electrode base member wherein a metal film is formed on a support having an organic film; such a negative electrode base member wherein the surface layer of the organic film is covered with a metal oxide film; a negative electrode base member wherein a metal film is formed on a support having a composite film formed from a composite film-forming material containing an organic component and an inorganic component; and a negative electrode base member wherein a silica coating is formed, on a support having a photoresist pattern, from a silica film-forming coating liquid and a metal film is formed on the support after removing the photoresist pattern.

Secondary cell having negative electrode base member

A process for production of nickel oxyhydroxide by electrolytic oxidation of nickel hydroxide in the presence of an alkali metal halide. The nickel oxyhydroxide is produced by adding nickel hydroxide particles to an aqueous solution of an alkali metal halide and stirring the mixture to prepare a nickel hydroxide slurry, and then converting a portion of the nickel hydroxide to nickel oxyhydroxide by electrolytic oxidation in the presence of the alkali metal halide.

Process for producing nickel oxyhydroxide by electrolytic oxidation

A nonconductor product is soaked in a solution suspending a semiconducting powder and is subjected to light irradiation in the solution so that polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating. With the method like this, the plated nonconductor product which does not cause problems such as environmental pollution and waste liquid treatment, and whose surface and plated coating is firmly adhered to each other, and, when a resin product is used as an object to be plated, deformation by heat of the resin product can be prevented, and moreover, the adherent strength of the plated coating can be improved.

Method of plating nonconductor product

A printed circuit board comprising a metal copper film having 10,to 10,micropores per square centimeter wherein the metal copper film is prepared by dipping a plating object into an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorus acid compound, a metallic catalyst for initiating the reductive reaction, and a compound containing an acetylenic bond.

Microporous copper film and electroless copper plating solution for obtaining the same

An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.

Electroless copper plating solution and method for electroless copper plating

A process for regenerating electroless plating bath comprising the steps of:

Process for regenerating electroless plating bath and a regenerating

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

Chemical copper-plating bath

Growing community of inventors

Kanagawa, Japan

Hideo Honma