Ebara Corporation

Kabushiki Kaisha Toshiba

Ricoh Company, Ltd.

Hideo Aizawa

Tadakazu Sone

Soichi Isobe

Hiroomi Torii

Masao Umemoto

Hiroshi Aono

Ryuichi Kosuge

Kenji Shinkai

Norio Kimura

Hiroyuki Shinozaki

Manabu Tsujimura

Hisanori Matsuo

Kenji Kamimura

Satoshi Wakabayashi

Makoto Akagi

Daisuke Koga

Katsuhiko Tokushige

Satoshi Okamura

Kenya Ito

Yoshikuni Tateyama

Kenichi Shigeta

Mitsuru Miyazaki

Junji Kunisawa

Toshio Yokoyama

Hiromi Yajima

Naoki Toyomura

Shozo Oguri

Masaaki Eriguchi

Makoto Kishino

A substrate polishing apparatus includes a polishing tablehaving a polishing surfacein the upper surface, a substrate holding portionthat holds a substrate W having a surface to be polished in the lower surface, and a holding portion coverthat covers the outer side of the substrate holding portion. Between the lower portion of the holding portion coverand the upper surface of the polishing table, a gap portion for intakeis provided, and in the upper portion of the holding portion cover, a pipe for exhaustconnected to an exhaust mechanismis provided. By operating the exhaust mechanism, a rising air current from the gap portiontoward the pipeis formed between the outer surface of the substrate holding portionand the inner surface of the holding portion cover

Substrate polishing apparatus

In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

Buff processing device and substrate processing device

The invention suppresses generation of noises attributable to rotation of a rotary joint. A rotary joint includes a rotating body that rotates on a rotating axis A, a housing disposed so as to surround the rotating body, and at least one bearing disposed between the rotating body and the housing and adapted to support rotation of the rotating body. The rotary joint supplies fluids through fluid connection ports formed in the housing and fluid passages formed inside the rotating body to a polishing table having attached thereto a polishing pad for polishing a substrate or a holding portion that is adapted to hold the substrate while pressing the substrate against the polishing pad. At least one elastic member is interposed at least either between the rotating body and the at least one bearing or between the housing and the at least one bearing.

Rotary joint and polishing apparatus

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus

A lifting deviceincludes a lifting mechanismand an adjustment member. The lifting mechanismis provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and adjusts height of the at least one unit with respect to the installation surface. The adjustment memberis provided with an extended sectionextended from the lifting mechanism, and is capable of operating the lifting mechanismthrough the extended section

Lifting device, substrate processing apparatus having lifting device, and unit transferring method

A polishing apparatus which can continue stable operation of the apparatus without generating torsional vibration in a rotary joint and without generating an abnormal sound at an engagement part between a cooling water pipe and a polishing table is disclosed. The polishing apparatus includes a rotary joint fixed to a rotating part of the polishing table or a rotating part of the top ring to supply a fluid into the polishing table or the top ring and discharge the fluid from the polishing table or the top ring, and a rotation-prevention mechanism which connects the rotary joint with an apparatus frame to prevent the rotary joint from being rotated. The rotation-prevention mechanism includes a link mechanism having at least one spherical plain bearing.

Polishing apparatus

A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

Polishing apparatus and polishing method

A gas-liquid separator separates gas-liquid two-phase flow into a gas and a liquid. The gas-liquid separator includes: a container having a bottom and a side portion, the bottom having a liquid discharge outlet and the side portion having a gas discharge outlet; a gas-liquid introduction pipe for introducing a gas-liquid two-phase flow into the container, the gas-liquid introduction pipe extending downward from above the container and having a lower end located in an interior of the container, the gas discharge outlet of the container being located above the lower end of the gas-liquid introduction pipe; and a guide device disposed in the gas-liquid introduction pipe and configured so as to impart a swirling motion to the gas-liquid two-phase flow in the gas-liquid introduction pipe.

Gas-liquid separator and polishing apparatus

A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover.

Polishing apparatus with polishing head cover

A memory system includes code data generating section which generates code data based on write data. A nonvolatile semiconductor memory stores the write data and the code data for the write data and outputs read data and the code data for the read data. An error correcting section is configured to correct an error bit included in the read data using the read data and the code data for the read data, and outputs the read data which includes the error bit in accordance with a setting. An interface section receives the write data from outside of the memory system, and outputs the read data to outside of the memory system.

Memory system, memory system controller, and a data processing method in a host apparatus

The present invention provides a memory controller which includes a host interface connected to a host apparatus and receives a first data write-in unit of reception data, a memory interface connected to nonvolatile semiconductor memory in which is written a second data write-in unit of data larger than the first data write-in unit of data, and transmits the first data write-in unit of write-in data, and a central processing unit, which writes the reception data in a temporary write-in block of the nonvolatile semiconductor memory via the memory interface, reads out from the temporary write-in block the write-in data corresponding to area data when a total amount of reception data received by the host interface has reached amount of the second data write-in unit of the area data, and writes the area data including the read-out write-in data in a target block different from the temporary write-in block.

Memory controller, memory device and control method for the memory controller

A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

Substrate delivery mechanism

An electronic card includes a printed circuit board which has a nonvolatile semiconductor memory mounted on one surface thereof, a card case covering the one surface of the printed circuit board, signal pins provided in one side on the other surface of the printed circuit board, a circuit pattern provided on the one surface of the printed circuit board, a first ground pattern provided on the one surface of the printed circuit board, the first ground pattern being electrically connected to the signal pin which is supplied with a grounding potential in a case where the electronic card is equipped with a host apparatus and a first insulator film provided on the one surface of the printed circuit board, and the first insulator film having a first opening in which the first ground pattern is exposed.

Growing community of inventors

Tokyo, Japan

Hideo Aizawa