Asahi Kasei Kogyo Kabushiki Kaisha

Hideo Ai

Akihiko Ikeda

Yoshio Matsuoka

Naohiro Tsuruta

Yohsuke Koizumi

Nobuo Nakazaki

Manabu Miyao

Masazumi Chono

Nobuhiko Suga

Yoshikazu Suda

Michihiro Aboshi

Jiro Sato

Naoji Yoshii

Hideaki Takahashi

Akihiko Ideda

Satoshi Ogitani

Kan-ichi Yokota

Polymer/oxime ester/coumarin compound photosensitive composition

A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula

Photocurable laminate

A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula ##STR1## wherein, each of X, X.sub.1, X.sub.2, X.sub.3 and X.sub.4 is a tetravalent carbocyclic or heterocyclic residue, each of Y.sub.1, Y.sub.2, and Y.sub.3 is a divalent carbocylic or heterocyclic residue, at least one of Z.sub.1 and Z.sub.2 is a residue having a reactive carbon-carbon double bond, and each of l, m, and n is an integer from 0 to 20, preferably from 0 to 10. The polyimide may include (a) polyacrylate compounds (b) bis-imide compounds (c) photosensitive polyimide precursors (d) oxime initiators (e) a 3 component sensitizer of a phenone compound, a mercapto compound, and an arylamine-alkanol, or mixtures of a,b,c,d, and e.

Tetramine derived polyimide with pendant unsaturation, and various

A linear polymer having a recurring unit represented by the formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each independently is a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, an aryl group, or a halogen atom and the ethynyl group is in either meta position or para position to the main polymer chain; and a weight-average molecular weight of 1,000 to 1,000,000. A resin composition consisting essentially of (i) a polymer having a recurring unit represented by the formula (I) or a polymer having a recurring unit represented by the formula (I) and a recurring unit represented by the formula (II): ##STR2## wherein X and Y each independently is a C.sub.6-20 aryl group, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, a silyl group having a C.sub.1-10 alkyl group or a C.sub.6-10 aryl group, a hydrogen atom or a halogen atom, and the ethynyl group of the unit (I) is in either meta position or para position to the main polymer chain; and the weight ratio of the unit (I) to the unit (II) ranges from 1/99 to 99.5/0.5 and (ii) at least one agent selected from the group consisting of (a) an improvement agent for casting and molding property in an amount of about 3 to about 50% by weight based on the weight of the polymer; (b) an adhesive agent in an amount of about 1 to about 15% by weight based on the weight of the polymer; and (c) a photocrosslinking initiator in an amount of about 0.1 to about 20% by weight based on the weight of the polymer.

Photocurable compositions of poly(ethynylphenyl)acetylene, its copolymer

Disclosed is an image-forming material having a high sensitivity to high-energy beams and excellent in dry etching resistance, heat stability and resolution which comprises a copolymer containing a total of 1 to 99 mole-% of at least one of recurring structural units represented by the following formulas [A] and [A'] and 1 to 99 mole-% of at least one recurring structural unit represented by the following formula [B] and having a number-average molecular weight of 500 to 1,000,000: ##STR1## wherein R.sub.1 of the formulas [A] and [A'] represents a hydrogen or halogen atom, or an alkyl group having 1 to 6 carbon atoms, the substituent groups R.sub.1, epoxy group, and thiiranyl group being attached to the position ortho, meta, or para to the carbon atom in the main chain; X, Y, and Z of the formula [B] represent each a hydrogen atom, halogen atom, cyano group, alkyl group having 1 to 6 carbon atoms, halogenated alkyl group having 1 to 6 carbon atoms, aryl group having 6 to 30 carbon atoms and bearing a substituent alkyl or halogenated alkyl group having 1 to 6 carbon atoms, aryl group having 6 to 30 carbon atoms, --COOR.sub.2, --COR.sub.2, --O--COR.sub.2 (wherein R.sub.2 represents an alkyl or halogenated alkyl group having 1 to 12 carbon atoms, aryl group having 6 to 30 carbon atoms and bearing a substituent alkyl or halogenated alkyl group having 1 to 6 carbon atoms, or aryl group having 6 to 30 carbon atoms), nitro group, substituent group containing a hetero ring bearing substituent R.sub.3 (R.sub.3 represents a hydrogen atom, hydroxyl group, carboxyl group, halogen atom, nitro group, amino group, cyano group, alkyl or halogenated alkyl group having 1 to 6 carbon atoms, or aryl group having 6 to 30 carbon atoms), or substituent group containing a silicon atom. An image forming method using this material and an image-forming element are also disclosed.

Image-forming materials sensitive to high-energy beam

A process for preparing a polyamide which comprises polycondensing a dicarboxylic acid and a diamine by using a combination of at least one phosphine and at least one disulfide as the condensing agent.

Process for preparing polyamide with organic phosphine/organic disulfide

A photopolymerizable laminate comprising a photopolymerizable layer and a support layer, said photopolymerizable layer containing; (1) 5 to 95% by weight, based on the total weight of the photopolymerizable layer, of a binder comprising a vinyl polymer or a vinyl copolymer, (2) 95 to 5% by weight, based on the total weight of the photopolymerizable layer, of a monomeric component containing at least 50% by weight of at least one compound selected from the group consisting of the photopolymerizable unsaturated compounds represented by the formulae (A), (B) and (C) shown below and having a value of molecular weight/number of double bonds contained of 1000 or less, and (3) 0.01 to 30% by weight, based on the total weight of the photopolymerizable layer, of a photopolymerization initiator. ##STR1##

Photopolymerizable laminate

A linear polymer having a recurring unit represented by the formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each independently is a hydrogen atom, a C.sub.1-10 alkyl group, a C.sub.6-10 cycloalkyl group, an aryl group, or a halogen atom and the ethynyl group is in either meta position or para position to the main polymer chain; and a weight-average molecular weight of 1,000 to 1,000,000.

Poly(ethynylphenyl)acetylene, its copolymer and composition thereof

A process for preparing polyamides which comprises polycondensing dicarboxylic acids having the following general formula and diamines by using carbodiimides as the condensing agent. ##STR1## wherein X is a group having a valence of (m+2), and C.sub.6-20 carbocyclic group, C.sub.3-20 heterocyclic group, C.sub.2-20 alkyl group, or C.sub.2-20 alkenyl group, the group having at least one carbon-carbon double bond in the position of conjugating to carboxylic acid radical or the group having an .alpha.,.beta.-unsaturated ketone structure;

Polyamide preparation from polycarboxylic acid and polyamine with

Novel copolymers having a weight average molecular weight of 500 to 5,000,000 and comprising 1 to 99% by weight of a recurring unit represented by the formula (I), 1 to 99% by weight of a recurring unit represented by the formula (II) and 0 to 98% by weight of a recurring unit represented by the formula (III): ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group; X is a hydrogen atom, a methyl group or a phenyl group; Y is a hydrogen atom, a halogen atom, a methyl group, a phenyl group or a cyano group; and Z is a phenyl group, a phenyl group substituted by at least one alkyl group having 1 to 8 carbon atoms, a polycyclic aromatic hydrocarbon group having 10 to 20 carbon atoms, a cyano group, --COOR.sup.2 (in which R.sup.2 is an alkyl group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms), --COR.sup.3 (in which R.sup.3 is an alkyl group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms), a nitro group, a pyridyl group, ##STR2## (in which R.sup.3 has the same meaning as defined above), or a halogen atom. The above-mentioned copolymers are useful as resist materials which are sensitive to high-energy radiations.

Epoxy compounds, process for the preparation thereof and resist

A resin composition comprising (A) a polymer having, in the molecule, at least two groups represented by the following structural formula (I): ##STR1## wherein R.sub.1 is isopropyl, sec-butyl, tert-butyl, a C.sub.5-20 alkyl group, a C.sub.3-20 cycloalkyl group, a C.sub.5-20 alkenyl group, a C.sub.3-20 hydroxyalkyl group, a C.sub.5-20 alkoxyalkyl group, a C.sub.3-20 aminoalkyl group, a C.sub.6-20 aryl group or a C.sub.6-20 arylalkyl group, and n is 0, 1 or 2, and (B) a polymer having an electron attractive group and an .alpha.,.beta.-ethylenic double bond adjacent thereto. Though said composition is stable at room temperature, it is crosslinked and cured at high temperatures because the amino group of the polymer (A) adds to the double bond of the polymer (B). Accordingly, said resin composition is suitable for use as a cathodic electrocoating material.

Resin composition, coating material comprising said resin composition

1,3,6-Tris(4,6-diamino-1,3,5-triazine-2-yl)hexane, and a flame retardant resin composition comprising (A) about 5 to about 100 parts by weight of 1,3,6-tris(4,6-diamino-1,3,5-triazine-2-yl)hexane and (B) 100 parts by weight of a thermosetting resin or a thermoplastic resin.

Growing community of inventors

Fuji, Japan

Hideo Ai