Sumitomo Bakelite Company Limited

Other

Hidenori Saito

Katsuya Asao

Nobuhiro Higashida

Maki Tokuhiro

Michio Nakajima

Takashi Enoki

Yuichi Ishida

Hitoshi Onishi

Hitoshi Morita

Tatsuhiro Yoshida

Tamotsu Ishida

Masako Okanuma

Masanori Fujimoto

Tsuyoshi Watanabe

Tsukasa Sakamoto

Tadahiro Ishikawa

Saiko Yoshihashi

Yayoi Yoshioka

Masaki Kimoto

A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same

Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device

Layer insulating film for multilayer interconnection, resin used therefor and process for producing the same

A primary object of the invention is to provide a production technology for functional polyamic acid microfine particles and functional polyimide microfine particles by which the particle shape, size and size distribution can be freely controlled. The invention is concerned with a process for synthesizing polyamic acid particles having functional groups at least on the surface from a tetracarboxylic anhydride and a diamine compound characterized by its comprising (a) a first step which comprises providing a tetracarboxylic anhydride and a diamine compound at least one of which has functional groups and preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound and (b) a second step which comprises mixing the first and second solutions under ultrasonic agitation to thereby precipitate polyamic acid microfine particles from the mixed solution. The invention is further concerned with a process which comprises imidating the above polyamic acid particles to provide polyimide microfine particles.

Functional polyamic acid microfine particles, functional polyimide microfine particles, and processes for their production

An object of the invention is to provide thermosetting amic acid microfine particles, thermosetting imide microfine particles and crosslinked imide microfine particles of controlled particle shape and size distribution. The invention provides a production technology which comprises mixing a first solution containing a tetracarboxylic anhydride and a C&boxH;C bond-containing acid anhydride with a second solution containing a diamine compound, causing precipitation of thermosetting amic acid microfine particles from the resulting mixture, and further producing thermosetting imide microfine particles and crosslinked imide microfine particles from the thermosetting amic acid microfine particles.

Thermosetting amic acid microfine particles, thermosetting imide microfine particles, crosslinked imide microfine particles, and processes for their production

Heat resistant polybenzoxazole resins useful as layer insulation films and protective films for semiconductor, layer insulation films for multilayer circuits, cover coats for flexible copper-clad sheets, solder resist films, liquid crystal-aligned films and the like. These resins have excellent thermal, electrical, physical and mechanical characteristics. Polybenzoxazole precursors are provided, represented by the general formula (A), and are used to obtain polybenzoxazole resins, represented by the general formula (D). In the formulas (A) and (D), n denotes an integer from 2-1000, and X denotes a structure having a formula selected from structures indicated at (B). In the formulas at (B), Y denotes a structure having a formula selected from those indicated at (C), and the hydrogen atom(s) on the benzene ring in these structures are optionally substituted.

Polybenzoxazole resin and precursor thereof

A process for producing polyimide microfine particles which is amenable to free control of particle morphology and particle diameter distribution is provided. A polyamic acid and a polyimide, each in the form of microfine particles with good monodispersibility, are also provided. There is also provided a process for producing polyimide microfine particles from a tetracarboxylic anhydride and a diamine compound which comprises (a) a first step of preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound, (b) a second step of mixing the first and second solutions and causing a polyamic acid to precipitate in the form of microfine particles from the mixed solution under ultrasonic agitation, and (c) a third step of imidating the polyamic acid particles to provide the objective polyimide in the form of microfine particles.

Polyamic acid and polyimide microfine particles and process for their production

A phenolic resin molding material for molding at lower than normal pressures, comprising as resin components a combination of (A) a crystalline phenolic compound having two or more hydroxyphenyl groups and (B) a compound having two or more hydroxyl groups in the benzene ring, or (A), (B) and (C) a phenolic resin.

Phenolic resin molding material including a crystalline phenolic

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Yokohama, Japan

Hidenori Saito