Nitto-Denko Corporation

Hidenori Onishi

Kazuhiro Fuke

Shinya Ota

Hiroyuki Katayama

Ryuichi Kimura

Yuki Ebe

Masayuki Hodono

Tomohiro Taruno

Shunsuke Shuto

Ryusuke Naito

Akihito Matsutomi

Naoko Yoshida

Yuichi Fukamichi

Yoshinori Kouno

A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheethas a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheethas a thickness T of 1 &#x3bc;m or more and 240 &#x3bc;m or less.

Porous liquid crystal polymer sheet and wiring circuit board

An optical semiconductor device includes a metal lead frame including first and second plate portions, an optical semiconductor element mounted on the metal lead frame, and a reflector provided around the optical semiconductor element. A material for the reflector is an epoxy resin composition containing: (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) at least one of a carboxylic acid and water. Components (C) and (D) are present in a total proportion of 69 to 94 wt % based on the amount of the overall epoxy resin composition, and the component (E) is present in a proportion of 4 to 23 mol % based on the total amount of the components (B) and (E). The resin composition has a higher glass transition temperature, and is excellent in moldability and blocking resistance and substantially free from warpage.

Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same

A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board; disposing a semiconductor element at one side in a thickness direction of the support sheet; disposing an encapsulating layer formed from an encapsulating resin composition containing a curable resin at the one side in the thickness direction of the support sheet so as to cover the semiconductor element; curing the encapsulating layer to encapsulate the semiconductor element by the encapsulating layer that is flexible; cutting the encapsulating layer that is flexible corresponding to the semiconductor element to produce an encapsulating layer-covered semiconductor element; and peeling the encapsulating layer-covered semiconductor element from the support sheet.

Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device

A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board formed with a through hole passing through in a thickness direction and a pressure-sensitive adhesive layer laminated on a surface at one side in the thickness direction of the support board so as to cover the through hole; disposing a semiconductor element on a surface at one side in the thickness direction of the pressure-sensitive adhesive layer in opposed to the through hole in the thickness direction; covering the semiconductor element with an encapsulating layer to produce an encapsulating layer-covered semiconductor element; and inserting a pressing member into the through hole from the other side in the thickness direction to peel the encapsulating layer-covered semiconductor element from the pressure-sensitive adhesive layer.

The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions.

Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device

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Osaka, Japan

Hidenori Onishi