Hosiden Corporation

Hidenori Motonaga

Kensuke Nakanishi

Hideo Yuasa

Ryuji Awamura

Katsunari Fujita

Tomohiko Kamimura

Hiroyuki Harano

Wei Wang

Tsutomu Matsushita

Naosuke Fukada

Mayumi Kaneko

Keina Tsutsui

Tetsuji Muraoka

Jinlong Ren

A detection sensor according to an aspect of the invention includes a vibratable film constituted by a piezoelectric film, a case accommodating the vibratable film, and a circuit board. The vibratable film is configured to be irradiated with infrared rays and thereby generate first electric signals through a pyroelectric effect, and configured to be vibrated by sound waves and thereby generate second electric signals through a piezoelectric effect. The case includes a transmissive part. The transmissive part is configured to transmit at least infrared rays and disposed on one side in a first direction relative to the vibratable film to face the vibratable film. The first direction is a thickness direction of the vibratable film. The circuit board is fixed to the case and disposed on the other side in the first direction relative to the vibratable film. The circuit board has a sound hole to input therethrough sound waves.

Detection sensor and detection device including the same

A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.

Microphone assembly

A microphone unit including a substrate, a microphone, a fixing member, and a film. The substrate includes a first face, a second face opposite to the first face, and a through-hole extending from the first face to the second face through the substrate. The microphone is mounted on or fixed onto the second face of the substrate and has a sound hole in communication with the through-hole of the substrate. The fixing member is fixed onto the first face of the substrate such as to be located around the through-hole. The film provides at least one of dustproofness and waterproofness and is fixed onto the fixing member such as to cover the through-hole.

Microphone unit

An electroacoustic transducing device such as a small speaker or receiver used in a portable telephone or the like. A yoke-integral frame is formed by a simple process, and the number of components and production steps for producing the electroacoustic transducing device are reduced, thereby improving productivity. The transducing device having: a magnetic circuit having a yoke, a magnet, and a pole piece; a vibration system having a diaphragm and a voice coil; and a frame which holds the magnetic circuit and the vibration system. The voice coil is placed in a magnetic gap, and the frame is formed by performing a pressing process on one sheet-like metal material into a bottomed tubular shape, and at least two places of the bottom plate being cut and raised to form a bottom frame-like yoke portion, thereby being formed into a yoke-integral type.

Electroacoustic transducing device

The present invention provides an electret condenser microphone including a diaphragm, a frame adapted to affix the diaphragm to, and a backplate positionable inside the frame and opposite the diaphragm with a space reserved therebetween.

Electret condenser microphone

An electroacoustic transducing device comprising: a magnetic circuit having a yoke, a magnet, and a pole piece; a vibration system having a diaphragm and a voice coil; and a frame which holds the magnetic circuit and the vibration system. The voice coil is placed in a magnetic gap, and has lead wires of the voice coil which are drawn out from the voice coil at positions which are remote from the diaphragm. Openings for air forming for forming slack portions in the lead wires are drawn out from the voice coil and are disposed in the frame. The lead wires are adequately subjected to the wire laying process, and the audio performance is prevented from being lowered.

Growing community of inventors

Shandong, China

Hidenori Motonaga