Nichia Corporation

Shinko Electric Industries Co., Ltd.

Hidenori Matsuo

Masaki Omori

Takashi Sasamuro

Norihiro Dejima

Hideaki Takeda

Tadaaki Miyata

Hideki Kondo

Wataru Katayama

Ryota Mitsui

A semiconductor laser device includes: a support base having a plurality of mounting surfaces arranged in a first direction, wherein heights of the mounting surfaces from a reference plane that is parallel to the first direction decrease stepwise or gradually along the first direction; a first semiconductor laser element secured to a first mounting surface; a second semiconductor laser element secured to a second mounting surface; a first slow-axis collimator lens secured to the first mounting surface, the first slow-axis collimator lens being located at a position at which the first laser light is incident; a second slow-axis collimator lens directly or indirectly secured to the second mounting surface, the second slow-axis collimator lens being located at a position at which the second laser light is incident; and a first sealing cover that defines an inner space in which the first and second semiconductor laser elements are held.

Semiconductor laser device

A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.

Laser light source

A method of manufacturing a laser light source includes: providing a submount, the submount having a principal surface on which a laser diode chip is to be fixed, and comprising a pair of lens supports each including an end surface, the end surfaces located at opposite sides with respect to an emission end surface of the laser diode chip; providing a lens having a bonding surface; performing adjustment such that end surfaces of the pair of lens supports of the submount are parallel to a reference plane; performing adjustment such that the bonding surface of the lens is parallel to the reference plane; and while maintaining the end surfaces of the pair of lens supports and the bonding surface of the lens so as to be parallel to the reference plane, bonding the end surfaces with the bonding surface of the lens using an inorganic bonding member.

Method of manufacturing laser light source

A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.

Package, light-emitting device, and laser device

A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.

Light source device including lead terminals that cross space defined by base and cap

A light source device includes a plurality of light sources each comprising a semiconductor laser device, a mounting body to which the plurality of light sources is attached, and at least one heat conducting member. The mounting body has a front surface to be a light emitting side and a rear surface opposite to the front surface. The rear surface has at least one first surface portion. Terminals of at least one of the plurality of light sources protrude from each of the at least one first surface portion. The rear surface has at least one second surface portion which is closer to the front surface than any one of the at least one first surface portion. Each of the at least one heat conducting member is in contact with corresponding one of the at least one second surface portion.

Light source device

A light source apparatus of the present invention has a plurality of semiconductor laser devices and a holding member; the semiconductor laser device includes: a semiconductor laser element; a placing body on which the semiconductor laser element is mounted; a substrate on which the placing body is biased to one side thereof; and a pair of terminals electrically connected to the semiconductor laser element, biased to the other side of the substrate and protruding from the substrate, and the holding member includes: holes aligned in at least a pair of rows; a thin-walled section on which the holes are arranged, the thin-walled section being formed by providing at least a pair of depressions on the other side; and a thick-walled section provided adjacent to the thin-walled section. The semiconductor laser device is mounted on one side of the holding member and the placing body of the semiconductor laser device is disposed on the thick-walled section, and the pair of terminals are exposed through the holes from the other side of the holding member.

Light source apparatus

A light source apparatus is provided which uses a plurality of semiconductor laser devices and which offers adequate heat dissipation. The light source apparatus using a plurality of semiconductor laser devices includes a holding member on which the plurality of semiconductor laser devices is arranged, wherein at least one semiconductor laser device among the plurality of semiconductor laser devices is arranged on the holding member such that a relative position of the semiconductor laser device in an optical axis direction with respect to an adjacent semiconductor laser device in a front view of the holding member is greater than a relative position of the semiconductor laser device in a direction perpendicular to the optical axis direction with respect to the adjacent semiconductor laser device.

A light source apparatus and a Projector including the light source apparatus are provided. The light source apparatus comprises: a plurality of light sources each including a laser diode and a collimating lens, said collimating lens making a light emitted from said laser diode into an approximately collimated beam, a plurality of housings in which said plurality of light sources are placed so that a light is emitted from each of said light source advances approximately in parallel in the same direction, a condenser lens which condenses lights which is emitted from said plurality of housings to a phosphor, a phosphor wheel having said phosphor, said phosphor wheel transmitting the lights which is emitted from said condenser lens, wherein incident angles of the lights emitted from said housings to an optical axis of said condenser lens are made different by varying mount angles of said housings to a supporting member.

Growing community of inventors

Hadano, Japan

Hidenori Matsuo