Sumitomo Electric Industries, Limited

Hidenori Kitai

Hiromu Shiomi

Kenji Fukuda

Hideto Tamaso

A semiconductor device includes a first JTE region formed around an active portion, a second JTE region formed around the first JTE region, and a third JTE region formed around the second JTE region. The first, second, and third JTE regions are doped with an impurity of a second conductivity type different from a first conductivity type. A concentration ratio R'(concentration of impurity in second JTE region)/(concentration of impurity in first JTE region)' and a concentration ratio R'(concentration of impurity in third JTE region)/(concentration of impurity in second JTE region)' are 0.50 or greater and 0.65 or less. A width Wof the first JTE region, a width Wof the second JTE region, and a width Wof the third JTE region are 130 &#x3bc;m or greater and 190 &#x3bc;m or less.

Schottky semiconductor device with junction termination extensions

The second conductivity type thin film includes: a high-concentration layer having a first impurity concentration; a first electric field relaxing layer continuous to the high-concentration layer at an outer circumference of the high-concentration layer, the first electric field relaxing layer having a second impurity concentration lower than the first impurity concentration; a second electric field relaxing layer continuous to the first electric field relaxing layer at an outer circumference of the first electric field relaxing layer, the second electric field relaxing layer having a third impurity concentration lower than the second impurity concentration; and a first electric field diffusion layer continuous to the second electric field relaxing layer at an outer circumference of the second electric field relaxing layer, the first electric field diffusion layer having a fourth impurity concentration lower than the third impurity concentration.

Semiconductor device

The current diffusion layer is interposed between the divided portions of the first base region. The second base region is provided adjacent to both sides of the trench current diffusion layer. The body region is provided on the trench current diffusion layer and the second base region. The source region is provided on the body region. The trench is provided to extend from a surface of the source region to the trench current diffusion layer through the source region and the body region. The trench has a bottom surface that is separated from and overlaps with the center portion of the first base region in a perpendicular direction. A width of the center portion in a horizontal direction is larger than a width of the bottom surface of the trench.

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Tsukuba, Japan

Hidenori Kitai