Nihon Dempa Kogyo Co., Ltd.

Hidenori Harima

Kouichi Moriya

Hiroaki Mizumura

Tsutomu Yamakawa

Fumio Asamura

Kenichi Sugawara

A bonding type crystal controlled oscillator includes a crystal package and a circuit package bonded by two-tier bonding. An anisotropy conductive adhesive is interposed between back surface of the crystal package facing the circuit package and an upper surface of the circuit package facing the crystal package. The anisotropy conductive adhesive includes a thermosetting resin containing solder micro particles dispersed in the thermosetting resin. Assuming that a thickness of the output terminal formed at the crystal package is C &#x3bc;m, a thickness of the external terminal formed at the circuit package is D &#x3bc;m, and an average outside diameter of the solder micro particles dispersed in the anisotropy conductive adhesive is E &#x3bc;m, the dimensional relation is set to (C+D)&#x3e;E.

Bonding type crystal controlled oscillator

A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.

Piezoelectric module

A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.

Surface mount piezoelectric oscillator

A piezoelectric device and a fabricating method thereof are provided. Variation of output frequency is suppressed by forming an organic resin to protect an IC chip that is mounted in a cavity of a container body, and damage that may occur to the IC chip during the mounting process is prevented. The piezoelectric device includes a container body, a crystal resonator, an IC chip and a cover body. A surface of the IC chip, which is a mounting surface for mounting to the container body, has bumps thereon for connecting to terminal pads of a circuit wiring pattern configured on a bottom surface of a bottom cavity of the container body, and the other surface of the IC chip has an insulating protective sheet adhered and fixed thereon.

Piezoelectric device and fabricating method thereof

There is provided a surface mount oscillator of a junction type in which the size of an IC chip is increased while maintaining high performance thereof, and the outer dimension of the oscillator in plan view are small. In a surface mount crystal oscillator which: a surface of an IC chip opposite to one principal surface thereof on which IC terminals are formed, is fixed on a mount substrate; external terminals that are constituted by a pair of crystal terminals and dummy terminals, at least one of which serves as a ground terminal, and that are formed in four corner sections of an outer bottom surface of a surface mount vibrator, are electrically connected to the IC terminals provided in four corner sections of the one principal surface; and IC terminals provided in positions other than the four corner sections are connected to circuit terminals of the mount substrate by means of wire bonding, the configuration is such that the external terminals of the surface mount vibrator constituted by the crystal terminals and the dummy terminals are electrically joined by means of joining balls to the IC terminals formed in the four corner sections of the IC chip.

Surface mount crystal oscillator

The crystal oscillator for surface mounting includes: a container body having first and second recesses on both principal surfaces thereof; a crystal blank hermetically encapsulated within the first recess; and an IC chip in which an oscillation circuit using the crystal blank is integrated, the IC chip being accommodated within the second recess. The IC chip is provided with a plurality of IC terminals including a pair of crystal terminals used for electrical connection with the crystal blank. A plurality of mounting electrodes to which the IC terminals are connected through flip-chip bonding are formed on a bottom surface of the second recess in correspondence with the IC terminals. A pair of mounting electrodes corresponding to the pair of crystal terminals are electrically connected to the crystal blank and also formed as a pair of dual-purpose electrodes having greater areas than the other mounting electrodes.

Crystal oscillator for surface mounting

A surface mount crystal oscillator comprises a crystal blank, an IC chip having an oscillation circuit integrated thereon, and a hermetic package for accommodating the crystal blank and IC chip therein. The hermetic package comprises a substantially rectangular ceramic substrate formed with a metal film which makes a round on one main surface thereof, and a concave metal cover having an open end face bonded to the metal film. The IC chip is secured to the one main surface of the ceramic substrate through ultrasonic thermo-compression bonding using bumps, the crystal blank is disposed above the IC chip, and the ceramic substrate has the one main surface formed as a flat surface.

Surface mount type crystal oscillator

In a surface-mount crystal oscillator, an IC chip having an IC terminal at each of at least four corner portions is housed in a substantially rectangular recess. Circuit terminals to which the IC terminals are fixed via bumps are provided on an inner bottom surface of the recess, and external terminals electrically connected to the circuit terminals are provided at the four corner portions of an opening end surface surrounding the recess. In each of at least three vertices or corners on the inner bottom surface of the recess, an external terminal corresponding to the vertex is formed into an L-shape to be in contact with a longer side and a shorter side of an outer perimeter of the recess, and an exposed part in which the inner bottom surface is exposed is formed between the circuit terminal which is the closest to the vertex and its external terminal.

Surface-mount crystal oscillator

A quartz crystal device includes: a crystal unit in which a crystal blank is hermetically encapsulated; and a mounting substrate housing an IC chip on which a circuit using the crystal blank is integrated. By joining an external terminal of the crystal unit and a bonding terminal of the mounting substrate, the mounting substrate is joined to the crystal unit to be integrated, and the quartz crystal device is configured. In the quartz crystal device, a crystal monitor terminal electrically connected to the bonding terminal is provided on an outer side surface of the mounting substrate, and even in a state in which the crystal unit and the mounting terminal are integrated, a vibration characteristic of the crystal blank is measurable by using the crystal monitor terminal.

Quartz crystal device including monitor electrode

A quartz crystal device includes: a quartz crystal blank having an outer perimeter part and a vibration region partially separated mechanically from the outer perimeter part by a cut-out groove; a first container joined to a first principal surface of the crystal blank by being joined to an entire perimeter of the perimeter part of the crystal blank via a brazing material layer in the first principal surface; and a second container joined to a second principal surface of the crystal blank by being joined to an entire perimeter of the outer perimeter part of the crystal blank via a brazing material layer in the second principal surface. The vibration region of the crystal blank is hermetically encapsulated in a space formed by the first container, the second container and the outer perimeter part of the crystal blank.

Quartz crystal device

A surface mount crystal oscillator comprises a package body having a first recess, a cover having a second recess, a crystal blank secured to an inner bottom surface of the second recess, and an IC chip secured to a bottom surface of the first recess. The IC chip has an oscillation circuit using the crystal oscillator integrated therein, and has IC terminals on one main surface for connection to the outside. A first and a second annular metal film are disposed to surround open end surfaces of the first recess and second recess, respectively. By bonding the first and second annular metal films with an eutectic alloy, the crystal blank and IC chip are hermetically sealed in a space defined by the integrated first and second recesses.

A method of manufacturing a surface mount type crystal oscillator having a container body including a first recess and a second recess respectively formed in two main surfaces thereof, a crystal blank hermetically sealed in the first recess, an IC chip having an oscillation circuit integrated thereon and secured to the bottom surface of the second recess through thermo-compression bonding using bumps, and a protection resin for protecting a circuit-forming surface of the IC chip comprises the steps of applying a protection resin consisting of a flexible resin along the inner periphery of the second recess, and pressing the IC chip while the outer periphery of the IC chip is brought into contact with the applied protection resin to secure the IC chip to the bottom surface of the second recess.

Method of manufacturing surface mount type crystal oscillator

A surface-mount crystal oscillator includes a quartz crystal unit, a mounting substrate on which an IC (Integrated Circuit) chip is mounted and which is bonded to the rear surface of the crystal unit, and an electronic components which is mounted on one end of the surface of the mounting substrate on which the crystal unit is bonded. The crystal unit includes a planar substrate, a quartz crystal blank held on one principal surface of the planar substrate, a metal film formed along the outer periphery of the principal surface, and a concave metal cover having an open-ended face. In the crystal unit, the open-ended face of the metal cover is brazed to the metal film, whereby the crystal blank is hermetically sealed between the metal cover and the planar substrate.

Growing community of inventors

Saitama, Japan

Hidenori Harima