Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Hidenobu Nishikawa

Hiroyuki Yamada

Hiroyuki Otani

Kazuto Nishida

Shuichi Takeda

Daido Komyoji

Shozo Ochi

Yoshinori Wada

Shuji Ono

Atsunobu Iwamoto

Hiroshi Sakurai

Kentaro Kumazawa

Naoto Hosotani

Hiroshi Nasu

Shigeru Kondou

Kazumichi Shimizu

Kenji Takahashi

Akihiro Yamamoto

Teruo Maruyama

Yutaka Nakamura

Yuichiro Yamada

Norihito Tsukahara

Daisuke Sakurai

Shigeaki Sakatani

Osamu Uchida

Masato Mori

Yoshikazu Yoshimura

Hiroshi Yamauchi

Masato Hirano

Kazuhiro Ikurumi

Takashi Sonoda

Sakae Kobayashi

Kojiro Nakamura

Mitsuo Maeno

Yasuharu Kikuchi

Naomi Kaino

The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

Circuit board and process for producing the same

Memory card () includes at least semiconductor chip (), circuit board () with semiconductor chip () mounted on main surface (), having at least rigidity reducing portion () formed in main surface () or in a linear region of surface () opposite to the main surface, and cover portion () for covering semiconductor chip () on main surface () of circuit board (), wherein circuit board () has a plurality of convex regions () which flex in a convex shape toward main surface () due to rigidity reducing portion ().

Memory card

A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.

Memory card and method for manufacturing the same

Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads () provided on a substrate upper surface (); a plurality of lower side pads () provided on a substrate lower surface () corresponding to the upper side pads () across the substrate (), respectively; a first semiconductor chip () having first bumps () joined to the upper side pads (), respectively; and a second semiconductor chip () having second bumps () joined to the lower side pads (), respectively.

Semiconductor chip assembly and fabrication method therefor

The semiconductor memory module incorporating antenna includes a wiring board () having a connection terminal () connected with a control semiconductor element () and arranged at a position exposed to the surface of an outer case (), and a terminal electrode () for antenna connection connected with the control semiconductor element () and arranged in the outer case (); a semiconductor storage element () mounted on one side of the wiring board (); and a loop-like antenna () and an antenna terminal electrode () formed on the other side of the wiring board () along the outer peripheral thereof, the wiring board () includes at least one magnetic body layer () and the terminal electrode () for antenna connection is connected with the antenna terminal electrode ().

Semiconductor memory module incorporating antenna

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component mounting method and apparatus

A memory card includes a circuit board, a first semiconductor chip mounted on the circuit board with a bump sandwiched between the first semiconductor chip and the circuit board, a second semiconductor chip mounted on the circuit board with a bump sandwiched between the second semiconductor chip and the circuit board with a clearance not greater than 1 mm between the first semiconductor chip and the second semiconductor chip, a first sealing resin layer surrounding the bump and existing between the first semiconductor chip and the circuit board, and a second sealing resin layer surrounding the bump and existing between the second semiconductor chip and the circuit board, and a cover covering the first semiconductor chip, the second semiconductor chip on a principal face of the circuit board.

Memory card and method for manufacturing memory card

A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

Memory card and memory card manufacturing method

An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.

Electronic circuit device and method for manufacturing same

Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

Card type information device and method for manufacturing same

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component unit

A semiconductor memory module formed of a mounted module () having a semiconductor memory device () and a control semiconductor device (), a circuit board () which contains connection terminal () coupled with the control semiconductor device () and disposed so that it is exposed from the surface of outer case (), and an antenna connection terminal electrode () disposed in the inside of outer case (); and an antenna module () having a sheet board () which includes an antenna () disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer () of magnetic substance disposed on the other surface, and an antenna terminal electrode () disposed on the one or the other surface. The antenna module () is overlaid on the mounted module (), and the antenna connection terminal electrode () is connected with the antenna terminal electrode ().

Semiconductor memory module having built-in antenna

An electronic component and a circuit formation article are bonded together with a bonding material containing resin interposed therebetween. In a state that bumps of an electronic-component bonding region and electrodes of the circuit formation article are in mutual electrical contact, the electronic component and the circuit formation article are thermocompression-bonded to each other upon curing of the bonding material. A bonding-material flow regulating member of the electronic-component bonding region regulates flow of the bonding material toward a peripheral portion of the electronic-component bonding region during bonding of the circuit formation article to the electronic component.

Growing community of inventors

Nara, Japan

Hidenobu Nishikawa