Samsung Electronics Co., Ltd.

Hidenobu Fukutome

Shigenobu Maeda

Young-Gun Ko

Joo-Hyun Jeong

Tsukasa Matsuda

A semiconductor device includes an interlayer insulating film formed on a substrate, a plurality of contacts formed in the interlayer insulating film, and an impurity-doped region formed around the contacts in the interlayer insulating film and along a lengthwise direction of the contacts.

Semiconductor device with impurity-doped region and method of fabricating the same

A semiconductor device is provided. The semiconductor device includes a first fin on a substrate, a first gate electrode formed on the substrate to intersect the first fin, a first elevated source/drain on the first fin on both sides of the first gate electrode, and a first metal alloy layer on an upper surface and sidewall of the first elevated source/drain.

Semiconductor device and fabricating method thereof

A semiconductor device can include an active region having a fin portion providing a channel region between opposing source and drain regions. A gate electrode can cross over the channel region between the opposing source and drain regions and first and second strain inducing structures can be on opposing sides of the gate electrode and can be configured to induce strain on the channel region, where each of the first and second strain inducing structures including a respective facing side having a pair of {111} crystallographically oriented facets.

Growing community of inventors

Seongnam-si, South Korea

Hidenobu Fukutome