The Furukawa Electric Co., Ltd.

Fuji Electric Co., Ltd.

Hidemichi Fujiwara

Tomohiro Ishii

Takuya Harada

Hideo Nishikubo

Yusuke Yamada

Nobumitsu Yamanaka

Shunji Masumori

Kazuhiro Takashiba

Norzafriza Nitta

Kengo Mitose

Yoshihiro Sato

Shigeki Sekiya

Tatsuhiko Asai

Naoyuki Kojima

Kunio Shiokawa

Toshiaki Asada

Takashi Unno

Shunichiro Sato

Masako Katayama

Kazuhito Hikasa

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

The present disclosure relates to a metal particle-containing composition contains at least one thermosetting resin (R), a hardening agent (H), and at least three types of metal particles (P) different from one another. The metal particles (P) contain a solder alloy particle (P1) containing a tin alloy containing at least one metal (A), wherein the metal (A) is a metal that forms a eutectic crystal with tin at a eutectic temperature of 200&#xb0; C. or lower, at least one metal particle (P2) containing a metal (B) having a melting point exceeding 420&#xb0; C. in a bulk, the metal particle (P2) having a melting point higher than a solidus temperature of the solder alloy particle (P1), and at least one metal particle (P3) containing a metal (C) that forms an intermetallic compound with a metal contained in the solder alloy particle (P1).

Metal particle-containing composition and electrically conductive adhesive film

A particle composition includes metal fine particles composed of a metal element having a bulk melting point of greater than 420&#xb0; C. with a primary particle diameter of primary particles of the metal fine particles being 1 nm to 500 nm, a part of or an entire surface of the metal fine particles being coated with a coating material; a low melting point metal powder composed of a metal or alloy having a bulk melting point of 420&#xb0; C. or less; and an activating agent that decomposes and removes the coating material from the surface of the metal fine particles after the low melting point metal powder is melted, wherein a content of the metal fine particles containing the coating material is 0.5 mass % to 50 mass %, and a ratio ([inorganic compound/metal fine particles]&#xd7;100 (mass %)) of the inorganic compound in the metal fine particles is 0.1 mass % to 50 mass %.

Metal fine particle-containing composition

A copper alloy wire rod has a chemical composition comprising Ag: 0.1 to 6.0 mass % and P: 0 to 20 mass ppm, the balance being copper with inevitable impurities. In a cross section parallel to a longitudinal direction of the wire rod, a number density of second phase particles each having an aspect ratio of greater than or equal to 1.5 and a size in a direction perpendicular to the longitudinal direction of the wire rod of less than or equal to 200 nm is greater than or equal to 1.4 particles/&#x3bc;m.

Copper alloy wire rod

A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

Conductive connecting member and manufacturing method of same

Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 &#x3bc;m, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %).

Electrically conductive paste, and electrically conducive connection member produced using the paste

A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30&#xb0; C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30&#xb0; C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.

Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method

A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material.

Heat transfer film, semiconductor device, and electronic apparatus

In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).

Fine particle dispersion and method for producing fine particle dispersion

A method for producing a fine particle dispersion includes the steps of reducing a metal ion to form a fine particle dispersion aqueous solution; adding an aggregation accelerator into the fine particle dispersion aqueous solution so that agglomerated or precipitated fine particles are separated to obtain fine particles; and re-dispersing the fine particles into an organic solvent containing an organic solvent having an amide group, a low boiling point organic solvent having a boiling point between 20&#xb0; C. and 100&#xb0; C. at a normal pressure, and an organic solvent having a boiling point higher than 100&#xb0; C. at a normal pressure and containing an alcohol and/or a polyhydric alcohol.

Method for producing fine particle dispersion and fine particle dispersion

Provided is an automobile power cable in which a stranded wire formed of a plurality of high conductive Al alloy strands each essentially consisted of 0.05 to 0.4 wt. % of Zr, 0.05 to 0.2 wt % of Fe, 0.05 to 0.2 wt. % of Si; and 0.003 to 0.05 wt. % in total of more than one or two kinds selected from a group consisting of Be, Sr, Mg, Ti and V; and the remainder of Al and unavoidable impurities, is coated thereover with an insulation layer made of flame-resistant polyolefin resin and a shield layer formed of a braid containing more than 99 wt. % of Al.

Power cable for mobile and terminal for the power cable

An electric distributor assembly for movable vehicle is provided which has a distribution cable which is easier to handle, having both a metal terminal excellent in workability and an Al alloy twisted wire conductor connected to the terminal so as to show superior connection characteristics. The twisted-wire conductor may be made of an Al or Al alloy which has conductivity of 50% IACS or more. The metal terminal is made of, preferably, an Al or Al alloy of which elongation is 20% or more. The terminal is connected with the cable conductor, preferably, with ultrasonic vibrations.

Growing community of inventors

Tokyo, Japan

Hidemichi Fujiwara