Daiwa Fine Chemicals Co., Ltd.

Ishihara Chemical Co., Ltd.

Other

C.uyemura Co., Ltd.

Omron Corporation

Shipley Company LLC

Ebara-udylite Co., Ltd.

Shikishima Tipton Mfg. Co., Ltd.

Shikishima Tipton Manufacturing Co. Ltd.

Motoo Kawasaki

Hidemi Nawafune

Keigo Obata

Takao Takeuchi

Shozo Mizumoto

Kiyotaka Tsuji

Yoshiaki Okuhama

Tetsuji Nishikawa

Hisamine Kobayashi

Ken Araki

Masakazu Yoshimoto

Yasuhito Kohashi

Akemi Kinoshita

Sadamasa Suzuki

Tetsuya Mori

Seiji Nakajima

Hideki Tsuchida

Koichi Yomogida

Seiichiro Nakao

Hidenori Tsuji

Masaru Seita

Masaaki Imanari

Ei Uchida

Shingo Kitamura

Masaki Haga

Emiko Tanaka

Shigeru Takatani

Masayuki Nishino

Yuji Kato

Tetsuya Kondo

Keiji Shiomi

Kim Dong Hyun

Kyoko Kuba

Mitsuo Komatsu

A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion.

Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film

To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.

Silver and silver alloy plating bath

A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3'-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.

A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method

This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 &#x3bc;m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Method for forming resin composite material

The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.

Plating bath and process for depositing alloy containing tin and copper

An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.

Aqueous solutions for obtaining noble metals by chemical reductive deposition

Aqueous solutions for obtaining metals by reductive deposition

Palladium-base electroless plating solution

An electroless copper plating bath is prepared by adding both a metal-cyano-complex used as a stabilizer and an agent for complexing the metal of the metal-cyano-complex to an electroless copper plating bath containing cupric ion, an agent for complexing the cupric ion and a reducing agent, and an article to be plated is immersed in the bath.

Electroless copper plating bath and method

An analytical method for determining by potentiometric titration formaldehyde in an electroless copper plating bath, which comprises using a hydroxylamine salt such as hydroxylamine hydrochloride as the titrant and using a silver electrode as the indicator electrode. This method can determine free formaldehyde in low concentration which takes part in the plating reaction.

Analytical method for determining formaldehyde in electroless copper

A vibratory plating method carried out by placing only workpieces and a plating liquid in a plating container, and applying an electric current across the plating liquid while vibrating the plating container so as to cause the workpieces to be plated as the workpieces are rolled and moved independently of one another along the plating container. By this plating method, workpieces can be plated uniformly in a very short period of time at a high current density and with a small amount of plating liquid. Moreover, it eliminates troublesome steps of manually suspending and removing workpieces from hangers.

Vibratory plating method

A vibratory plating apparatus having a plating liquid in a plating container, a base on which the container is mounted for vibrating movement, and a lid for the top of the container. The bottom of the container has an arcuate bottom. A vibration motor vibrates the container and electrodes are disposed within the container. With this plating apparatus, workpieces can be plated uniformly in a very short period of time at a high current density and with a small amount of plating liquid. Moreover, it eliminates troublesome steps of manually suspending and removing workpieces from hangers.

Vibratory plating apparatus

A sludge containing a sparingly soluble metal compound such as nickel carbonate or the like is supplied to an anode compartment or an intermediate compartment of an electrolytic cell provided with an anode compartment and a cathode compartment or with an anode compartment, an intermediate compartment and a cathode compartment each sectioned by a filter membrane or an ion-exchange membrane, and thereafter an electrolytic treatment is conducted by using an insoluble electrode as anode and a usual electrode as cathode to precipitate a metal such as nickel on the cathode. Effective recovery of a metal is attained directly from a sludge by way of electrolysis.

Method of recovering metals from sludges

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Takatsuki, Japan

Hidemi Nawafune