Canon Kabushiki Kaisha

Hidemasa Oshige

Nobutaka Ukigaya

Takahiro Hachisu

Yuichi Kazue

Norihiko Nakata

A semiconductor device comprises a first substrate; a functional element arranged on a main surface of the first substrate; a terminal connected to an electrode electrically connected to the functional element and arranged on a second substrate different from the first substrate; an insulating portion configured to cover an end of the terminal; and a conductive film arranged on the terminal and the insulating portion and containing a conductive particle, wherein in a section perpendicular to the main surface of the first substrate, the insulating portion includes a top and lateral sides inclined with respect to the top, and a width of the top is smaller than a diameter of the conductive particle.

Semiconductor device having an insulating portion with a top smaller in width than a diameter of a conductive particle, display device, image capturing device, and electronic apparatus

A semiconductor device including an element substrate having a main surface provided with a pixel region where a plurality of pixels are arranged and a peripheral region where an alignment mark and a plurality of terminals are arranged, is provided. The semiconductor device further includes a transparent insulating layer configured to cover the alignment mark and not to cover the plurality of terminals and each portion between the plurality of terminals.

Semiconductor device, light emitting device, display device, photoelectric conversion device, electronic apparatus, illumination device, and moving body

A semiconductor apparatus according to an embodiment of the present disclosure, in a plan view with respect to the primary face of a semiconductor device, includes at least a part of an outer edge of a color filter layer being located between an effective pixel region and a joining member, and the distance from the effective pixel region to at least a part of the outer edge is greater than the distance from the color filter layer to a light transmission plate in the effective pixel region.

Semiconductor apparatus, module, camera, and equipment

A display apparatus includes a display device and a light transmission plate overlapping the display device. The display device has a display region. A void is provided between the display region and the light transmission plate. Between the display region and the light transmission plate, a distance G from a front surface of the display device facing the void to a main surface of the light transmission plate facing the void is greater than a height difference H of the front surface in the display region. The height difference H is greater than 1 μm.

Display apparatus, module, and equipment

A semiconductor apparatus includes an element substrate including an effective pixel region having a plurality of effective pixels on one principal surface side of a first substrate, and a peripheral region positioned around the effective pixel region, a second substrate, and a first and a second bonding member configured to bond the both substrates. The second bonding member includes a material different from that of the first bonding member. In a planar view with respect to the one principal surface, the second substrate is disposed within the element substrate. The first bonding member is provided between the peripheral region and the second substrate. The second bonding member is provided between the effective pixel region and the second substrate. In a planar view with respect to the one principal surface, at least a part of an end portion of the second substrate is positioned on the first bonding member.

Semiconductor apparatus having first and second bonding members, display apparatus, photoelectric conversion apparatus, electronic device, illumination apparatus, and moving body

An electronic component includes an electronic device including a substrate, and a wiring board including a conductor unit electrically connected to the electronic device and an insulation unit configured to support the conductor unit. The substrate includes a front surface including a first region, a back surface including a second region, and an end surface connecting the front surface and the back surface. The substrate further includes a first portion located between the first region and the second region and a second portion having a thickness smaller than that of the first portion. The insulation unit of the wiring board is located between a virtual plane surface located between the first region and the second region and the second portion.

Electronic component and device

A viewfinder comprising a display device which comprises a surface including a display portion and a peripheral portion, a lens and a housing is provided. In an orthogonal projection with respect to the surface, the housing comprises an overlap portion and a shielding portion that overlap at least a part of the peripheral portion, respectively. A distance between the peripheral portion and the shielding portion is larger than a distance between the peripheral portion and the overlap portion. A light beam emitted from an end of the display portion which has an angle less than a predetermined angle from a normal of the surface enters the lens, and a light beam emitted from the end which has an angle not less than the predetermined angle from the normal of the surface and is reflected by the overlap portion enters the shielding portion.

Electronic viewfinder and image capturing apparatus

A display apparatus, comprising an element substrate including a display portion formed by arraying a plurality of organic light emitting elements on a base and a connecting portion provided on the base so as to be separated from the display portion, a driving substrate connected to the connecting portion so as to be configured to drive the display portion, and a heat-insulating portion provided between the display portion and the connecting portion in planar view in the base and configured to have lower heat conductivity than the base.

Display apparatus and method of manufacturing the same

A semiconductor device disclosed includes a semiconductor substrate, an electrode layer arranged over the semiconductor substrate, and a conductive member provided in an opening and electrically connected to the electrode layer, and the opening penetrates the semiconductor substrate and reaches the electrode layer. The conductive member includes a metal portion and a barrier metal portion provided between a side surface of the opening and the metal portion, the barrier metal portion includes a first layer and a second layer provided between the first layer and the metal portion, and the second layer is denser than the first layer.

Semiconductor device and method of manufacturing semiconductor device

An electronic viewfinder is provided. The electronic viewfinder includes a display device including a display portion and a peripheral portion positioned around the display portion, an eyepiece optical system facing the display device, and a light absorbing resin member facing a space between the display device and the eyepiece optical system. In a normal direction with respect to a first surface, of the display device, on a side of the eyepiece optical system, the light absorbing resin member includes an overlap portion that overlaps at least a part of the peripheral portion. A distance from a second surface, facing the eyepiece optical system, of the overlap portion to the first surface in the normal direction is not less than 1/11 of a focal length of the eyepiece optical system.

Electronic viewfinder, image capturing apparatus, and display module

A semiconductor device manufacturing method includes forming a first mask over a semiconductor substrate including a first and second surfaces and an electrode provided on the second surface side, forming a first part having tapered shape by etching the semiconductor substrate with the first mask as a mask, forming a second mask covering a side surface of the first part and exposing the bottom surface of the first part, forming a second part reaching the electrode by etching the semiconductor substrate with the second mask as a mask, forming an insulating film covering the side surfaces of the first and second parts, and forming a conductive member connected to the electrode in the first and second parts. A difference between a maximum width and a minimum width of the second part is smaller than a difference between a maximum width and a minimum width of the first part.

Semiconductor device with conductive member in tapered through-hole in semiconductor substrate and method of manufacturing semiconductor device

According to one aspect of the present invention, a method of manufacturing a semiconductor device is provided, which includes a bonding step bonding a semiconductor substrate having a semiconductor element disposed on a first surface, to a support substrate, at least through an adhesive layer between the semiconductor substrate and the support substrate, and a groove forming step forming a groove in a scribe area of the semiconductor substrate, from a side of a second surface of the semiconductor substrate, the second surface being opposite to the first surface, and in the groove forming step, a conductive layer between the semiconductor substrate and the support substrate is exposed at a bottom of the groove, without the adhesive layer being exposed in the groove.

Growing community of inventors

Yokohama, Japan

Hidemasa Oshige