Murata Manufacturing Co., Ltd.

Hidemasa Kawai

Akio Katsube

Hideo Nakagoshi

An electronic component manufacturing method that efficiently grinds a cover layer provided on a substrate even when the substrate is warped includes the step of forming first grooves at intervals in a cover layer provided on a substrate by repeating grinding with a rotary blade at a pitch more than a thickness W of the rotary blade. Next, at least portions provided in the cover layer along the first grooves are removed to reduce the thickness of the cover layer by repeating grinding at a pitch equal to or less than the thickness W of the rotary blade.

Electronic component manufacturing method

An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.

Growing community of inventors

Yoshida-gun, Japan

Hidemasa Kawai