Hitachi Aic Inc.

Hideki Yoshida

Ryouji Sugiura

A recess is formed in a land () of an LED reflecting plate () formed of a metal plate. The recess comprises a flat LED chip mounting portion () and a reflecting portion () inclined with respect to the LED chip mounting portion (). The LED reflecting plate () is mounted on a printed wiring board () such that the land () is fitted in a first through hole (). An LED chip () mounted on the LED chip mounting portion () is connected to a terminal portion () formed on the printed wiring board (). The printed wiring board () is diced along a third through hole () to form an LED device () as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device () can be improved, and the manufacturing cost can be decreased.

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Ibaraki, Japan

Hideki Yoshida