Alps Electric Co., Ltd.

Hideki Watanabe

Masashi Nakagawa

Shoji Kai

Yoshihisa Shibuya

Shunji Kuwana

A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.

High-frequency module

An electronic device with excellent shielding is provided. A case body formed with a metal plate has a side wall, bent with respect to holes formed in a flat plate. The side wall has extruded portions to cover the holes. In comparison with conventional art, radio wave leakage from the holes is reduced.

Electronic device with excellent shielding and productivity

A printed circuit board mounting structure is disclosed wherein first and second printed circuit boards are mounted by mounting projections formed on a case. Since the mounting projections can be used in common for both first and second printed circuit boards, the printed circuit board mounting structure of the invention is simple in the mounting work, high in productivity and low in cost as compared with a conventional like structure wherein first and second printed circuit boards are mounted to different mounting projections.

Structure for mounting two printed circuit boards to one case

A unit part mounting structure in which mounting legs are soldered onto soldering lands at a side of the printed board to which the unit part is mounted, so that mounting of the unit part to the printed board is made easier, and repairing and replacement of the unit part can be performed without removing the printed board, thereby making it easier to perform the repairing and replacement. In conventional unit part mounting structures, the unit part is mounted to a side of the printed board not having a conductive pattern, connecting portions of a housing are inserted into holes in the printed board, and the printed board is turned upside down to solder the connecting portions. Thus, it takes time and effort to insert and solder the unit part P. The unit part mounting structure of the invention overcomes such a problem.

Growing community of inventors

Miyagi-ken, Japan

Hideki Watanabe